Inventor · disambiguated record
Battista Vitali
Also filed as: VITALI BATTISTA
5 granted patents·2 pending applications·40 citations·filing 1999–2018
76Inventor score
Files withST MICROELECTRONICS SRL7
Top patents by PatentIndex Score
7 records- 0171US10872845B2Process for manufacturing a flip chip semiconductor package and a corresponding flip chip packageST MICROELECTRONICS SRL·Filed 2018·Granted Dec 22, 2020·2 cites·14 claims
- 0262US10141197B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2016·Granted Nov 27, 2018·1 cites·21 claims
- 0357US6260753B1Gold bumps bonding on connection pads and subsequent coining of their vertexST MICROELECTRONICS SRL·Filed 1999·Granted Jul 17, 2001·26 cites·25 claims
- 0456US6581816B2Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor deviceST MICROELECTRONICS SRL·Filed 2001·Granted Jun 24, 2003·11 cites·7 claims
- 0550US10741415B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2018·Granted Aug 11, 2020·0 cites·19 claims
- 0634US2004072396A1Semiconductor electronic device and method of manufacturing thereofST MICROELECTRONICS SRL·Filed 2003·Application pending·0 cites
- 0733US2003146500A1Package for semiconductor device with ground lead connection having high stress resistanceST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →