Inventor · disambiguated record
Ichiro Hayashi
Also filed as: HAYASHI ICHIRO
19 granted patents·7 pending applications·372 citations·filing 1986–2023
95Inventor score
Files withHAYASHI ICHIRO6TAKIMOTO YUKIHIRO4AG TECHNOLOGY CORP3MITSUBISHI ELECTRIC CORP3DAIWA CAN CO LTD2
Top patents by PatentIndex Score
26 records- 0194US9915802B2Lens driving device, camera module, and camera mounting deviceMURAKAMI TOMOYUKI·Filed 2015·Granted Mar 13, 2018·24 cites·15 claims
- 0294US9568743B2Lens holder drive device, camera module, and portable terminal provided with cameraHAYASHI ICHIRO·Filed 2014·Granted Feb 14, 2017·26 cites·16 claims
- 0391US9791661B2Lens driving apparatus, camera module, and camera-equipped mobile terminalHAYASHI ICHIRO·Filed 2016·Granted Oct 17, 2017·8 cites·9 claims
- 0489US5900296AGlass substrate for magnetic diskAG TECHNOLOGY CORP·Filed 1996·Granted May 4, 1999·79 cites·5 claims
- 0588US10126522B2Lens drive device, camera module, and mobile terminal with cameraKUDO SHOTA·Filed 2015·Granted Nov 13, 2018·8 cites·8 claims
- 0688US5569518AGlass substrate for a magnetic disk with roughened edgesAG TECHNOLOGY CORP·Filed 1994·Granted Oct 29, 1996·43 cites·4 claims
- 0787US9405088B2Lens driving apparatus, camera module, and camera-equipped mobile terminalHAYASHI ICHIRO·Filed 2013·Granted Aug 2, 2016·7 cites·6 claims
- 0883US10073236B2Lens driving apparatus, camera module, and camera-equipped mobile terminalHAYASHI ICHIRO·Filed 2017·Granted Sep 11, 2018·3 cites·9 claims
- 0982US5238876AMethod of dividing semiconductor wafer using ultraviolet sensitive tapeMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Aug 24, 1993·78 cites·8 claims
- 1078US5871654AMethod for producing a glass substrate for a magnetic diskAG TECHNOLOGY CORP·Filed 1996·Granted Feb 16, 1999·39 cites·4 claims
- 1174US10775639B2Lens driving device, camera module, and camera mounting apparatusTAKIMOTO YUKIHIRO·Filed 2018·Granted Sep 15, 2020·2 cites·7 claims
- 1269US10527818B2Lens driving device, camera module, and camera mounting deviceMURAKAMI TOMOYUKI·Filed 2017·Granted Jan 7, 2020·1 cites·6 claims
- 1364US5332406AApparatus for producing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 26, 1994·32 cites·5 claims
- 1462US12306527B2Optical actuator, camera module, and camera-mounted deviceTAKIMOTO YUKIHIRO·Filed 2023·Granted May 20, 2025·0 cites·7 claims
- 1560US2015008230A1Container for foodDAIWA CAN CO LTD·Filed 2014·Application pending·0 cites
- 1659US7382783B2Multiplex transmission apparatus and multiplex transmission method for encapsulating data within a connectionless payloadNTT DOCOMO INC·Filed 2002·Granted Jun 3, 2008·4 cites·13 claims
- 1758US2010003495A1Transparent conductive film and method for manufacturing the transparent conductive film, and sputtering target used in the methodASAHI GLASS CO LTD·Filed 2009·Application pending·0 cites
- 1856US12448196B2Packaging containerDAIWA CAN CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·16 claims
- 1956US2023067072A1Optical actuator, camera module, and camera-mounted deviceHAYASHI ICHIRO·Filed 2022·Application pending·0 cites
- 2053US2023288720A1Optical actuator, camera module, and camera-mounted deviceTAKIMOTO YUKIHIRO·Filed 2023·Application pending·0 cites
- 2152US12111460B2Lens driving device, camera module, and camera-mounted apparatusOSAKA TOMOHIKO·Filed 2020·Granted Oct 8, 2024·0 cites·4 claims
- 2252US2019049691A1Lens drive device, camera module, and mobile terminal with cameraKUDO SHOTA·Filed 2018·Application pending·0 cites
- 2350US4775085ASemiconductor wafer breaking apparatusMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Oct 4, 1988·18 cites·4 claims
- 2447US2016178923A1Lens holder drive device, camera module, and portable terminal provided with cameraHAYASHI ICHIRO·Filed 2014·Application pending·0 cites
- 2540US11698540B2Lens drive device, camera module, and camera mount deviceTAKIMOTO YUKIHIRO·Filed 2018·Granted Jul 11, 2023·0 cites·4 claims
- 2638US2002142768A1Position display system using wireless mobile terminalsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →