Inventor · disambiguated record
Masashi Konda
Also filed as: KONDA MASASHI
7 granted patents·140 citations·filing 1991–1997
87Inventor score
Technology areasH10W
Files withNIPPON STEEL CORP7
Top patents by PatentIndex Score
7 records- 0179US5687901AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1995·Granted Nov 18, 1997·54 cites·30 claims
- 0261US5857610AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1997·Granted Jan 12, 1999·22 cites·11 claims
- 0355US5362984ASemiconductor device with jumping wireNIPPON STEEL CORP·Filed 1992·Granted Nov 8, 1994·24 cites·21 claims
- 0442US5803339AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1997·Granted Sep 8, 1998·9 cites·30 claims
- 0542US5150198ARadiator for semiconductor chipNIPPON STEEL CORP·Filed 1991·Granted Sep 22, 1992·13 cites·25 claims
- 0640US5137479ALead structure for packaging semiconductor chipNIPPON STEEL CORP·Filed 1991·Granted Aug 11, 1992·12 cites·9 claims
- 0731US5114878AMethod of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the sameNIPPON STEEL CORP·Filed 1991·Granted May 19, 1992·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →