Inventor · disambiguated record
Jurgen Schulz-Harder
Also filed as: SCHULZ-HARDER JUERGEN · SCHULZ-HARDER JURGEN · Schulz-Harder Jürgen
48 granted patents·10 pending applications·777 citations·filing 1990–2014
98Inventor score
Files withCURAMIK ELECTRONICS GMBH18SCHULZ-HARDER JUERGEN8SCHULZ-HARDER JURGEN7ELECTROVAC AG2BRÄUTIGAM JOHANN1
Top patents by PatentIndex Score
58 records- 0193US7940526B2Electrical moduleCURAMIK ELECTRONICS GMBH·Filed 2006·Granted May 10, 2011·34 cites·23 claims
- 0291US8130807B2Diode laser array and method for manufacturing such an arraySCHULZ-HARDER JURGEN·Filed 2008·Granted Mar 6, 2012·20 cites·24 claims
- 0387US6014312ACooler or heat sink for electrical components or circuits and an electrical circuit with this heat sinkCURAMIK ELECTRONICS GMBH·Filed 1998·Granted Jan 11, 2000·122 cites·28 claims
- 0483US8749052B2Electronic deviceSchulz-Harder Jürgen·Filed 2010·Granted Jun 10, 2014·10 cites·15 claims
- 0583US6638592B1Ceramic/metal substrate, especially composite substrateFiled 2000·Granted Oct 28, 2003·37 cites·25 claims
- 0681US7299967B2Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacksELECTROVAC AG·Filed 2005·Granted Nov 27, 2007·6 cites·5 claims
- 0781US6207221B1Process for producing a metal-ceramic substrate and a metal-ceramic substrateFiled 2000·Granted Mar 27, 2001·32 cites·18 claims
- 0880US5987893AHeat exchanger arrangement and cooling system with at least one such heat exchanger arrangementCURAMIK ELECTRONICS GMBH·Filed 1998·Granted Nov 23, 1999·78 cites·46 claims
- 0977US8683682B2Method for the production of a metal-ceramic substrateSCHULZ-HARDER JURGEN·Filed 2005·Granted Apr 1, 2014·7 cites·20 claims
- 1076US8342384B2Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrateCURAMIK ELECTRONICS GMBH·Filed 2012·Granted Jan 1, 2013·3 cites·15 claims
- 1172US5981036AMetal ceramic substrateFiled 1997·Granted Nov 9, 1999·42 cites·32 claims
- 1271US7814655B2Heat sink in the form of a heat pipe and process for manufacturing such a heat sinkELECTROVAC AG·Filed 2008·Granted Oct 19, 2010·4 cites·12 claims
- 1370US7800908B2Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sinkCURAMIK ELECTRONICS GMBH·Filed 2004·Granted Sep 21, 2010·17 cites·41 claims
- 1470US7051793B1Cooler for electrical componentsSCHULZ-HARDER JURGEN·Filed 1999·Granted May 30, 2006·39 cites·33 claims
- 1570US5465898AProcess for producing a metal-ceramic substrateFiled 1994·Granted Nov 14, 1995·40 cites·12 claims
- 1666US6345665B1Cooling systemFiled 1999·Granted Feb 12, 2002·32 cites·14 claims
- 1766US5527620AMetal coated substrate having improved resistivity to cyclic temperature stressFiled 1994·Granted Jun 18, 1996·35 cites·10 claims
- 1864US9730310B2Metal-ceramic substrateCURAMIK ELECTRONICS GMBH·Filed 2013·Granted Aug 8, 2017·2 cites·13 claims
- 1964US8974914B2Metal-ceramic substrate and method for manufacturing such a substrateMEYER ANDREAS·Filed 2011·Granted Mar 10, 2015·2 cites·13 claims
- 2063US9434509B2Package for metal-ceramic substrate and method for packing such substratesBRÄUTIGAM JOHANN·Filed 2011·Granted Sep 6, 2016·4 cites·8 claims
- 2163US6066219AProcess for producing a ceramic substrate and a ceramic substrateCURAMIK ELECTRONICS GMBH·Filed 1997·Granted May 23, 2000·29 cites·11 claims
- 2262US6877869B2Mirror for laser applications and method for manufacture of said mirrorCURAMIK ELECTRONICS GMBH·Filed 2002·Granted Apr 12, 2005·9 cites·20 claims
- 2362US6386278B1CoolerFiled 1999·Granted May 14, 2002·28 cites·21 claims
- 2461US8377240B2Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said methodCURAMIK ELECTRONICS GMBH·Filed 2005·Granted Feb 19, 2013·4 cites·27 claims
- 2561US8069561B2Method for manufacturing a metal-ceramic substrateSCHULZ-HARDER JUERGEN·Filed 2006·Granted Dec 6, 2011·2 cites·13 claims
- 2659US8056230B2Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacksSCHULZ-HARDER JUERGEN·Filed 2005·Granted Nov 15, 2011·2 cites·11 claims
- 2757US8435640B2Metal-ceramic substrateSCHULZ-HARDER JUERGEN·Filed 2006·Granted May 7, 2013·1 cites·23 claims
- 2857US8021920B2Method for producing a metal-ceramic substrate for electric circuits on modulesCURAMIK ELECTRONICS GMBH·Filed 2010·Granted Sep 20, 2011·1 cites·11 claims
- 2957US7811655B2Metal-ceramic substrateCURAMIC ELECTRONICS GMBH·Filed 2005·Granted Oct 12, 2010·2 cites·13 claims
- 3056US7036711B2Process for the manufacture of metal-ceramic compound material in particular metal-ceramic substrates and metal-ceramic compound material especially metal-ceramic substrate manufactured according to this processSCHULZ-HARDER JURGEN·Filed 2002·Granted May 2, 2006·3 cites·25 claims
- 3156US5508089AMultiple substrate and process for its productionFiled 1994·Granted Apr 16, 1996·21 cites·17 claims
- 3255US8559475B2Heat sink and assembly or module unitHAMMEL ERNST·Filed 2007·Granted Oct 15, 2013·2 cites·29 claims
- 3354US7000316B2Conductor board and method for producing a conductor boardCURAMIK ELECTRONICS GMBH·Filed 2003·Granted Feb 21, 2006·4 cites·18 claims
- 3453US5924191AProcess for producing a ceramic-metal substrateCURAMIK ELECTRONICS GMBH·Filed 1997·Granted Jul 20, 1999·21 cites·12 claims
- 3552US2014334103A1Cooled electric unitROGERS GERMANY GMBH·Filed 2014·Application pending·0 cites
- 3651US7528470B2Conductor board and method for producing a conductor boardCURAMIK ELECTRONICS GMBH·Filed 2005·Granted May 5, 2009·0 cites·30 claims
- 3751US6475401B1Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this processFiled 2000·Granted Nov 5, 2002·3 cites·46 claims
- 3851US5676855AMultiple substrate and process for its productionFiled 1995·Granted Oct 14, 1997·15 cites·9 claims
- 3947US7187545B2Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and supportCURAMIK ELECTRONICS GMBH·Filed 2003·Granted Mar 6, 2007·4 cites·24 claims
- 4047US2014338162A1Process for producing dcb substratesCURAMIK ELECTRONICS GMBH·Filed 2012·Application pending·0 cites
- 4145US8481842B2Process for producing Peltier modules, and Peltier moduleSCHULZ-HARDER JUERGEN·Filed 2007·Granted Jul 9, 2013·0 cites·15 claims
- 4244US2008118706A1SubstrateSCHULZ-HARDER JURGEN·Filed 2005·Application pending·0 cites
- 4344US2012069524A1Cooled electric unitSCHULZ-HARDER JUERGEN·Filed 2010·Application pending·0 cites
- 4443US6093443AProcess for producing a ceramic-metal substrateCURAMIK ELECTRONICS GMBH·Filed 1998·Granted Jul 25, 2000·10 cites·20 claims
- 4542US2014345664A1Thermoelectric generator module, metal-ceramic substrate and method of producing such a metal-ceramic substrateCURAMIK ELECTRONICS GMBH·Filed 2013·Application pending·0 cites
- 4641US6345437B1Process for the manufacturing of an arched metal ceramic substratumCURAMIK ELECTRONICS GMBH·Filed 1998·Granted Feb 12, 2002·10 cites·42 claims
- 4741US5721044AMultiple substrateFiled 1996·Granted Feb 24, 1998·9 cites·25 claims
- 4841US2005126758A1Heat sink in the form of a heat pipe and process for manufacturing such a heat sinkFiled 2003·Application pending·0 cites
- 4939US8584924B2Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrateSCHULZ-HARDER JUERGEN·Filed 2003·Granted Nov 19, 2013·0 cites·17 claims
- 5039US5382830ASemiconductor module with multi-plane conductive pathFiled 1991·Granted Jan 17, 1995·12 cites·15 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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