Inventor · disambiguated record
Seongho Park
Also filed as: PARK SEONGHO
13 granted patents·5 pending applications·30 citations·filing 2006–2025
85Inventor score
Files withLG ELECTRONICS INC5SAMSUNG ELECTRONICS CO LTD5HEWLETT PACKARD DEVELOPMENT CO3IMEC VZW2CALYX TECHNOLOGY INC D B A CAL1
Top patents by PatentIndex Score
18 records- 0194US10575692B2Vacuum cleanerLG ELECTRONICS INC·Filed 2017·Granted Mar 3, 2020·20 cites·22 claims
- 0290US10611293B2Lamp for vehicleZKW GROUP GMBH·Filed 2017·Granted Apr 7, 2020·9 cites·21 claims
- 0362US10923402B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·1 cites·15 claims
- 0460US10663918B2Support device and image forming apparatus having the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 26, 2020·0 cites·20 claims
- 0559US11005281B2Charging deviceLG ELECTRONICS INC·Filed 2020·Granted May 11, 2021·0 cites·19 claims
- 0657US2025029872A1Method for producing an interconnect viaIMEC VZW·Filed 2024·Application pending·0 cites
- 0754US12271129B2Intermediate transfer belt assembly with shutter structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Apr 8, 2025·0 cites·15 claims
- 0853US2024318307A1Substrate processing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0952US2007129958A1Data sharing system and methodCALYX TECHNOLOGY INC D B A CAL·Filed 2006·Application pending·0 cites
- 1051US10501006B2Lamp for vehicle and vehicleLG ELECTRONICS INC·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 1150US10742045B2Charging deviceLG ELECTRONICS INC·Filed 2017·Granted Aug 11, 2020·0 cites·18 claims
- 1250US2025300006A1Split conductive via fabricationIMEC VZW·Filed 2025·Application pending·0 cites
- 1348US12111604B2Structure for mounting development cartridge in image forming apparatusHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Oct 8, 2024·0 cites·15 claims
- 1447US2025136792A1Plastic composite material comprising coffee grounds and method for preparing same, and product using same and characteristics of productSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1546US10062606B2Methods of fabricating a semiconductor device having a via structure and an interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·15 claims
- 1645US10973381B2Vacuum cleanerLG ELECTRONICS INC·Filed 2017·Granted Apr 13, 2021·0 cites·20 claims
- 1740US9905458B2Methods of fabricating a semiconductor device having a via structure and an interconnection structureSIEW YONGKONG·Filed 2015·Granted Feb 27, 2018·0 cites·20 claims
- 1838US11250163B2Server and data management methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →