Inventor · disambiguated record
Reyn Qin
Also filed as: QIN REYN
3 granted patents·2 citations·filing 2017–2018
53Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR CO LTD3
Top patents by PatentIndex Score
3 records- 0165US10297535B2Die package component with jumper structure and manufacturing method thereofTAIWAN SEMICONDUCTOR CO LTD·Filed 2018·Granted May 21, 2019·1 cites·4 claims
- 0261US10037964B1Die-packaging component with retaining structure for package body thereofTAIWAN SEMICONDUCTOR CO LTD·Filed 2017·Granted Jul 31, 2018·1 cites·9 claims
- 0345US10312183B2Die package component with jumper structureTAIWAN SEMICONDUCTOR CO LTD·Filed 2017·Granted Jun 4, 2019·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →