Inventor · disambiguated record
Keita Umemoto
Also filed as: UMEMOTO KEITA
5 granted patents·9 pending applications·2 citations·filing 2012–2020
62Inventor score
Top patents by PatentIndex Score
14 records- 0175US9607812B2Sputtering target and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2013·Granted Mar 28, 2017·2 cites·6 claims
- 0255US2015211108A1Sputtering target and producing method thereofMITSUBISHI MATERIALS CORP·Filed 2013·Application pending·0 cites
- 0353US10283332B2Cu—Ga binary alloy sputtering target and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 7, 2019·0 cites·6 claims
- 0453US2022042166A1Tungsten oxide sputtering targetMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 0552US2022025510A1Tungsten oxide sputtering targetMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 0649US9988710B2Sputtering target and method for producing sameZHANG SHOUBIN·Filed 2012·Granted Jun 5, 2018·0 cites·7 claims
- 0749US9934949B2Sputtering target and production method of the sameMITSUBISHI MATERIALS CORP·Filed 2014·Granted Apr 3, 2018·0 cites·7 claims
- 0848US10883169B2Sputtering target and method for producing sputtering targetMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jan 5, 2021·0 cites·4 claims
- 0946US2019271069A1Cu-Ga SPUTTERING TARGET AND METHOD OF MANUFACTURING Cu-Ga SPUTTERING TARGETMITSUBISHI MATERIALS CORP·Filed 2017·Application pending·0 cites
- 1046US2016118232A1Sputtering target and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 1142US2019039131A1Sputtering target and method of manufacturing sputtering targetMITSUBISHI MATERIALS CORP·Filed 2017·Application pending·0 cites
- 1239US2017236695A1Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGETMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
- 1338US2017178876A1Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAMEMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
- 1438US2017298499A1Sputtering target and method for manufacturing sameMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →