Inventor · disambiguated record
Te-Hao Lee
Also filed as: LEE TE-HAO
23 granted patents·123 citations·filing 2011–2019
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13TAIWAN SEMICONDUCTOR MFG4CHU CHIA-HUA2LEE TE-HAO2GLOBALWAFERS CO LTD1
Top patents by PatentIndex Score
23 records- 0197US9133017B2MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·49 cites·20 claims
- 0296US8987059B2MEMS devices and methods of forming sameLIANG KAI-CHIH·Filed 2012·Granted Mar 24, 2015·46 cites·20 claims
- 0391US8729646B2MEMS devices and methods for forming the sameCHU CHIA-HUA·Filed 2012·Granted May 20, 2014·9 cites·20 claims
- 0482US8748205B1MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 10, 2014·5 cites·20 claims
- 0580US9617147B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·2 cites·20 claims
- 0678US9466532B2Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the sameCHU CHIA-HUA·Filed 2012·Granted Oct 11, 2016·4 cites·20 claims
- 0777US9452924B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Sep 27, 2016·2 cites·20 claims
- 0877US9006015B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·2 cites·20 claims
- 0969US8623768B2Methods for forming MEMS devicesLEE TE-HAO·Filed 2011·Granted Jan 7, 2014·3 cites·18 claims
- 1067US10071905B2Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·1 cites·20 claims
- 1165US11011601B2Narrow gap device with parallel releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1264US11180365B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1364US11018218B2Narrow gap device with parallel releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 1461US10457550B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 1559US10160633B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 1657US10497776B2Narrow gap device with parallel releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 3, 2019·0 cites·20 claims
- 1757US10099919B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·0 cites·21 claims
- 1854US9499396B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 1954US8969979B2MEMS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·0 cites·20 claims
- 2052US10155655B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·0 cites·20 claims
- 2152US9450109B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·0 cites·20 claims
- 2247US8828772B2High aspect ratio MEMS devices and methods for forming the sameLEE TE-HAO·Filed 2012·Granted Sep 9, 2014·0 cites·20 claims
- 2342US9611548B2Wafer rotating apparatusGLOBALWAFERS CO LTD·Filed 2016·Granted Apr 4, 2017·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Te-Hao Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →