Inventor · disambiguated record
Ryoichi Takagi
Also filed as: TAKAGI RYOICHI
11 granted patents·383 citations·filing 1989–2002
92Inventor score
Top patents by PatentIndex Score
11 records- 0196US4961052AProbing plate for wafer testingMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 2, 1990·141 cites·8 claims
- 0286US5266894AApparatus and method for testing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 30, 1993·55 cites·15 claims
- 0384US5436559AMethod for testing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 25, 1995·45 cites·10 claims
- 0473US6356096B2Test board for testing a semiconductor device utilizing first and second delay elements in a signal-transmission-pathMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 12, 2002·35 cites·8 claims
- 0572US5969533AProbe card and LSI test method using probe cardMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 19, 1999·34 cites·3 claims
- 0669US6704897B1Semiconductor device and the test system for the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Mar 9, 2004·14 cites·8 claims
- 0758US6486690B1Device under test board and testing methodMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 26, 2002·9 cites·16 claims
- 0855US6282680B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 28, 2001·18 cites·15 claims
- 0955US6150831ATest method and device for semiconductor circuitMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 21, 2000·19 cites·15 claims
- 1049US7080302B2Semiconductor device and test system thereforRENESAS TECH CORP·Filed 2002·Granted Jul 18, 2006·4 cites·17 claims
- 1142US5844263ASemiconductor integrated device having independent circuit blocks and a power breaking means for selectively supplying power to the circuit blocksMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Dec 1, 1998·9 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →