Inventor · disambiguated record
Jae-Sik Chung
Also filed as: CHUNG JAE-SIK
14 granted patents·3 pending applications·569 citations·filing 2001–2011
93Inventor score
Top patents by PatentIndex Score
17 records- 0199US7276799B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 2, 2007·429 cites·10 claims
- 0297US7537959B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·52 cites·10 claims
- 0395US8368231B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·12 cites·19 claims
- 0492US7985501B2Integral cap assembly having protective circuit module, and secondary battery comprising the sameLG CHEMICAL LTD·Filed 2009·Granted Jul 26, 2011·14 cites·18 claims
- 0587US7977156B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 12, 2011·11 cites·20 claims
- 0685US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 0776US7855144B2Method of forming metal lines and bumps for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 21, 2010·7 cites·15 claims
- 0876US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 0973US8415044B2Label indicating exposure to moisture attached to molded battery caseCHUNG JAE SIK·Filed 2010·Granted Apr 9, 2013·2 cites·5 claims
- 1069US6692874B2Electrolytes and lithium ion battery using the sameLG CHEMICAL LTD·Filed 2001·Granted Feb 17, 2004·11 cites·8 claims
- 1164US7307340B2Wafer-level electronic modules with integral connector contactsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 11, 2007·11 cites·38 claims
- 1260US7828859B2Method for manufacturing a battery having a battery after service label, and a battery manufactured by the methodLG CHEMICAL LTD·Filed 2005·Granted Nov 9, 2010·2 cites·7 claims
- 1353US7648797B2Unification type cap assembly containing protection circuit board and secondary battery comprising the sameLG CHEMICAL LTD·Filed 2005·Granted Jan 19, 2010·0 cites·11 claims
- 1451US8206849B2Integral cap assembly having protective circuit module, and secondary battery comprising the sameKIM HYUNGCHAN·Filed 2011·Granted Jun 26, 2012·0 cites·6 claims
- 1545US2008185738A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1642US2007069320A1Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1735US2006017161A1Semiconductor package having protective layer for re-routing lines and method of manufacturing the sameCHUNG JAE-SIK·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →