Inventor · disambiguated record
Rama I. Hegde
Also filed as: HEGDE RAMA I
29 granted patents·2 pending applications·1,413 citations·filing 1993–2017
97Inventor score
Top patents by PatentIndex Score
31 records- 0197US6020024AMethod for forming high dielectric constant metal oxidesMOTOROLA INC·Filed 1997·Granted Feb 1, 2000·461 cites·26 claims
- 0296US6432779B1Selective removal of a metal oxide dielectricMOTOROLA INC·Filed 2001·Granted Aug 13, 2002·139 cites·2 claims
- 0396US5972804AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Oct 26, 1999·181 cites·15 claims
- 0492US6300202B1Selective removal of a metal oxide dielectricMOTOROLA INC·Filed 2000·Granted Oct 9, 2001·113 cites·20 claims
- 0591US7091568B2Electronic device including dielectric layer, and a process for forming the electronic deviceFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Aug 15, 2006·59 cites·20 claims
- 0691US6383873B1Process for forming a structureMOTOROLA INC·Filed 2000·Granted May 7, 2002·66 cites·12 claims
- 0789US6717226B2Transistor with layered high-K gate dielectric and method thereforMOTOROLA INC·Filed 2002·Granted Apr 6, 2004·52 cites·7 claims
- 0888US6187682B1Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of materialMOTOROLA INC·Filed 1998·Granted Feb 13, 2001·94 cites·21 claims
- 0985US6297173B1Process for forming a semiconductor deviceMOTOROLA INC·Filed 1999·Granted Oct 2, 2001·52 cites·21 claims
- 1083US6136682AMethod for forming a conductive structure having a composite or amorphous barrier layerMOTOROLA INC·Filed 1997·Granted Oct 24, 2000·73 cites·19 claims
- 1181US10147697B1Bond pad structure for semiconductor device packagingNXP USA INC·Filed 2017·Granted Dec 4, 2018·3 cites·20 claims
- 1281US7445976B2Method of forming a semiconductor device having an interlayer and structure thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·22 claims
- 1377US5383354AProcess for measuring surface topography using atomic force microscopyMOTOROLA INC·Filed 1993·Granted Jan 24, 1995·41 cites·28 claims
- 1472US10121652B1Formation of metal oxide layerNXP USA INC·Filed 2017·Granted Nov 6, 2018·1 cites·20 claims
- 1572US8440507B1Lead frame sulfur removalHEGDE RAMA I·Filed 2012·Granted May 14, 2013·3 cites·16 claims
- 1671US6255204B1Method for forming a semiconductor deviceMOTOROLA INC·Filed 1999·Granted Jul 3, 2001·31 cites·19 claims
- 1761US9076783B2Methods and systems for selectively forming metal layers on lead frames after die attachmentHEGDE RAMA I·Filed 2013·Granted Jul 7, 2015·1 cites·11 claims
- 1861US8637393B1Methods and structures for capping a structure with a protective coatingHEGDE RAMA I·Filed 2012·Granted Jan 28, 2014·1 cites·18 claims
- 1959US5580823AProcess for fabricating a collimated metal layer and contact structure in a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Dec 3, 1996·33 cites·6 claims
- 2053US9559077B2Die attachment for packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 31, 2017·0 cites·19 claims
- 2152US9590063B2Method and structure for a large-grain high-K dielectricFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 7, 2017·0 cites·14 claims
- 2251US10763115B2Substrate treatment method for semiconductor device fabricationNXP USA INC·Filed 2017·Granted Sep 1, 2020·0 cites·19 claims
- 2351US9337164B2Coating layer for a conductive structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 10, 2016·0 cites·28 claims
- 2450US10367071B2Method and structure for a large-grain high-k dielectricNXP USA INC·Filed 2017·Granted Jul 30, 2019·0 cites·14 claims
- 2550US8313947B2Method for testing a contact structureHEGDE RAMA I·Filed 2010·Granted Nov 20, 2012·0 cites·22 claims
- 2647US10217698B2Die attachment for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·14 claims
- 2747US9343422B2Structure for aluminum pad metal under ball bondHEGDE RAMA I·Filed 2014·Granted May 17, 2016·0 cites·18 claims
- 2846US7439105B2Metal gate with zirconiumFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 21, 2008·0 cites·22 claims
- 2945US2009035928A1Method of processing a high-k dielectric for cet scalingHEGDE RAMA I·Filed 2007·Application pending·0 cites
- 3043US8921176B2Modified high-K gate dielectric stackHEGDE RAMA I·Filed 2012·Granted Dec 30, 2014·0 cites·18 claims
- 3135US2017011905A1Method of making a packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →