Inventor · disambiguated record
Su-Yu Yeh
Also filed as: YEH SU-YU
29 granted patents·19 pending applications·96 citations·filing 2000–2025
95Inventor score
Top patents by PatentIndex Score
48 records- 0194US11430909B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·3 cites·20 claims
- 0293US11527543B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0389US11532658B2Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 0483US2025275190A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0583US2025324589A1Polysilicon Removal In Word Line Contact Region Of Memory DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0682US12317545B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0781US11029603B2Chemical replacement systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·3 cites·20 claims
- 0880US2024047496A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0979US12376297B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1079US2025354543A1Cryogenic pump for semiconductor processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1179US2025357319A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1278US10879289B1Method for forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·20 claims
- 1378US10872873B2Method for bonding wafers and bonding toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·3 cites·20 claims
- 1478US2025349609A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1578US2024363791A1Bsi chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1676US11804529B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 1776US6702900B2Wafer chuck for producing an inert gas blanket and method for usingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 9, 2004·26 cites·9 claims
- 1876US2023120006A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1975US12094997B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 2074US12041771B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2174US6372663B1Dual-stage wet oxidation process utilizing varying H2/O2 ratiosTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 16, 2002·21 cites·19 claims
- 2274US2024384402A1System and method for cleaning a pre-clean process chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2374US2022359598A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2472US6444541B1Method for forming lining oxide in shallow trench isolation incorporating pre-annealing stepTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 3, 2002·23 cites·17 claims
- 2571US2024387146A1Wafer treatment system and method of treating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2671US2025105055A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2770US12241157B2System and method for cleaning a pre-clean process chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 2870US11652133B2Image sensor grid and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 2970US11282931B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 3070US11004709B2Method for monitoring gas in wafer processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·1 cites·20 claims
- 3170US10943802B2Photoresist bottle containerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 9, 2021·1 cites·20 claims
- 3268US11454891B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 3368US2024337265A1Cryogenic pump for semiconductor processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3466US11899368B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3566US11069740B2Image sensor grid and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 3665US2023013102A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3761US2022351948A1Method for treating semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3858US12183550B2Wafer treatment system and method of treating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 3958US2025226322A1Interconnect layer with different dielectric regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4057US2025014946A1Cut Metal Gate Refill With Buffer LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4154US11061333B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·20 claims
- 4253US6530103B2Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 11, 2003·3 cites·8 claims
- 4352US2021249232A1Apparatus and method for etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 4448US2025031399A1Barrier layers in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4547US6875705B2Method of high selectivity wet etching of salicidesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·4 cites·20 claims
- 4646US10050159B2Lens structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 4744US11164903B2Image sensor with pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 4836US6605812B1Method reducing the effects of N2 gas contamination in an ion implanterTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 12, 2003·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →