Inventor · disambiguated record
Chiou Jun Yean
Also filed as: YEAN CHIOU JUN
2 granted patents·1 citations·filing 2016–2020
35Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
2 records- 0170US10535572B2Device arrangement structure assembly and test methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 14, 2020·1 cites·20 claims
- 0260US11024552B2Device arrangement structure assembly having adhesive tape layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 1, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →