Inventor · disambiguated record
Eric P. Lewandowski
Also filed as: LEWANDOWSKI ERIC · LEWANDOWSKI ERIC P · LEWANDOWSKI ERIC PETER
35 granted patents·3 pending applications·69 citations·filing 2012–2024
96Inventor score
Top patents by PatentIndex Score
38 records- 0196US10692831B1Stud bumps for post-measurement qubit frequency modificationIBM·Filed 2019·Granted Jun 23, 2020·12 cites·24 claims
- 0296US9586857B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2015·Granted Mar 7, 2017·13 cites·20 claims
- 0395US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 0492US10879202B1System and method for forming solder bumpsIBM·Filed 2019·Granted Dec 29, 2020·6 cites·15 claims
- 0586US10833241B1Thermalization structure for cryogenic temperature devicesIBM·Filed 2019·Granted Nov 10, 2020·4 cites·25 claims
- 0684US9738560B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 0780US11195799B2Hybrid readout package for quantum multichip bondingIBM·Filed 2020·Granted Dec 7, 2021·1 cites·14 claims
- 0880US10881788B2Delivery device including reactive material for programmable discrete delivery of a substanceIBM·Filed 2015·Granted Jan 5, 2021·4 cites·14 claims
- 0979US10622590B2Method of forming a homogeneous solid metallic anode for a thin film microbatteryIBM·Filed 2018·Granted Apr 14, 2020·0 cites·17 claims
- 1079US9586291B2Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation releaseGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 7, 2017·3 cites·13 claims
- 1177US11165010B2Cold-welded flip chip interconnect structureIBM·Filed 2019·Granted Nov 2, 2021·2 cites·14 claims
- 1277US10686164B2Cathode for thin film microbatteryIBM·Filed 2018·Granted Jun 16, 2020·0 cites·15 claims
- 1376US2024421113A1Uniform chip gaps via injection-molded solder pillarsIBM·Filed 2024·Application pending·0 cites
- 1475US11258132B2Microbattery separatorIBM·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 1575US9508566B2Wafer level overmold for three dimensional surfacesIBM·Filed 2014·Granted Nov 29, 2016·3 cites·18 claims
- 1675US9321245B2Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosionGLOBALFOUNDRIES INC·Filed 2013·Granted Apr 26, 2016·3 cites·16 claims
- 1775US8815725B2Low alpha particle emission electrically-conductive coatingIBM·Filed 2013·Granted Aug 26, 2014·1 cites·16 claims
- 1872US10608158B2Two-component bump metallizationIBM·Filed 2017·Granted Mar 31, 2020·1 cites·25 claims
- 1971US8987130B2Reactive bonding of a flip chip packageFRITZ GREGORY M·Filed 2012·Granted Mar 24, 2015·3 cites·17 claims
- 2069US10096802B2Homogeneous solid metallic anode for thin film microbatteryIBM·Filed 2014·Granted Oct 9, 2018·1 cites·14 claims
- 2167US11990437B2System and method for forming solder bumpsIBM·Filed 2020·Granted May 21, 2024·0 cites·14 claims
- 2267US9806299B2Cathode for thin film microbatteryIBM·Filed 2014·Granted Oct 31, 2017·1 cites·18 claims
- 2366US11749605B2Hybrid under-bump metallization componentIBM·Filed 2020·Granted Sep 5, 2023·0 cites·13 claims
- 2465US11043690B2Sandwich-parallel micro-batteryIBM·Filed 2019·Granted Jun 22, 2021·0 cites·5 claims
- 2565US9181440B2Low alpha particle emission electrically-conductive coatingIBM·Filed 2013·Granted Nov 10, 2015·0 cites·8 claims
- 2664US10388929B2Microbattery separatorIBM·Filed 2015·Granted Aug 20, 2019·0 cites·13 claims
- 2762US12107065B2Uniform chip gaps via injection-molded solder pillarsIBM·Filed 2020·Granted Oct 1, 2024·0 cites·8 claims
- 2861US10629797B2Two-component bump metallizationIBM·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 2959US12506137B2High capacity compact lithium thin film batteryIBM·Filed 2019·Granted Dec 23, 2025·0 cites·9 claims
- 3058US10069116B2Cathode for thin film microbatteryIBM·Filed 2017·Granted Sep 4, 2018·0 cites·15 claims
- 3157US11895932B2Selective chemical frequency modification of Josephson junction resonatorsIBM·Filed 2020·Granted Feb 6, 2024·0 cites·17 claims
- 3257US10535592B2Method for forming solder bumps using sacrificial layerIBM·Filed 2018·Granted Jan 14, 2020·0 cites·17 claims
- 3354US10937735B2Hybrid under-bump metallization componentIBM·Filed 2018·Granted Mar 2, 2021·0 cites·10 claims
- 3453US11158781B2Permanent wafer handlers with through silicon vias for thermalization and qubit modificationIBM·Filed 2019·Granted Oct 26, 2021·0 cites·17 claims
- 3551US2014377572A1Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosionIBM·Filed 2013·Application pending·0 cites
- 3649US9953908B2Method for forming solder bumps using sacrificial layerIBM·Filed 2015·Granted Apr 24, 2018·0 cites·8 claims
- 3748US11766729B2Molten solder injection head with vacuum filter and differential gauge systemIBM·Filed 2017·Granted Sep 26, 2023·0 cites·15 claims
- 3844US2015137366A1Reactive bonding of a flip chip packageIBM·Filed 2015·Application pending·0 cites
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