Inventor · disambiguated record
Kenichi Iwashita
Also filed as: IWASHITA KENICHI
6 granted patents·6 pending applications·18 citations·filing 2008–2023
73Inventor score
Top patents by PatentIndex Score
12 records- 0187US10388608B2Semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 20, 2019·8 cites·19 claims
- 0282US8298747B2Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic partMINEGISHI TOMONORI·Filed 2008·Granted Oct 30, 2012·10 cites·24 claims
- 0354US9829791B2Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist patternHITACHI CHEMICAL CO LTD·Filed 2014·Granted Nov 28, 2017·0 cites·20 claims
- 0454US2025142731A1Wiring substrate production method, wiring substrate, reticle, and exposure pattern-rendering data structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 0553US2025267799A1Method for manufacturing wiring board, method for evaluating resist layer or wiring board, and wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0650US2024341039A1Method for manufacturing wiring board, and wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0747US10656521B2Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrateHITACHI CHEMICAL CO LTD·Filed 2015·Granted May 19, 2020·0 cites·20 claims
- 0847US2024015889A1Method for producing wiring board, and wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0946US9841678B2Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist patternHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·20 claims
- 1043US10324375B2Photosensitive resin composition, photosensitive film, and method for forming resist patternHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 18, 2019·0 cites·12 claims
- 1142US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 1234US2017329220A1Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrateHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →