Inventor · disambiguated record
Yoke Hor Phua
Also filed as: PHUA YOKE HOR
6 granted patents·1 pending application·8 citations·filing 2011–2021
73Inventor score
Top patents by PatentIndex Score
7 records- 0182US8524577B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressurePHUA YOKE HOR·Filed 2012·Granted Sep 3, 2013·7 cites·22 claims
- 0268US12148677B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0361US9627338B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageSTATS CHIPPAC LTD·Filed 2014·Granted Apr 18, 2017·1 cites·24 claims
- 0450US11227809B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·25 claims
- 0549US10916482B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressureJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2013·Granted Feb 9, 2021·0 cites·10 claims
- 0648US2013256923A1Semiconductor Device and Method of Forming Reconstituted Wafer With Larger Carrier to Achieve More EWLB Packages Per Wafer with Encapsulant Deposited Under Temperature and PressureSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 0745US8513098B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressurePHUA YOKE HOR·Filed 2011·Granted Aug 20, 2013·0 cites·22 claims
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