Inventor · disambiguated record
Akio Yasukawa
Also filed as: YASUKAWA AKIO
25 granted patents·3 pending applications·968 citations·filing 1978–2010
97Inventor score
Files withHITACHI LTD19HITACHI AUTOMOTIVE SYSTEMS LTD2KATSURA ROLLERS MFG CO LTD2HANZAWA KEIJI1HITACHI CAR ENG CO LTD1
Top patents by PatentIndex Score
28 records- 0196US6166937AInverter device with cooling arrangement thereforHITACHI LTD·Filed 1999·Granted Dec 26, 2000·265 cites·1 claims
- 0295US6877383B2Capacitive type pressure sensorHITACHI LTD·Filed 2002·Granted Apr 12, 2005·61 cites·2 claims
- 0395US6414867B2Power inverterHITACHI LTD·Filed 2001·Granted Jul 2, 2002·169 cites·5 claims
- 0495US6167761B1Capacitance type pressure sensor with capacitive elements actuated by a diaphragmHITACHI LTD AND HITACHI CAR EN·Filed 1998·Granted Jan 2, 2001·130 cites·10 claims
- 0592US7437927B2Thermal type gas flow meterHITACHI LTD·Filed 2007·Granted Oct 21, 2008·23 cites·15 claims
- 0685US5793106ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·86 cites·15 claims
- 0781US4205257AMagnetron strap ring structureHITACHI LTD·Filed 1978·Granted May 27, 1980·19 cites·3 claims
- 0880US7469582B2Heating resistor type flow measuring device housing structure having projection and recess for preventing mis-installationHITACHI LTD·Filed 2007·Granted Dec 30, 2008·9 cites·9 claims
- 0979US4672825AAntistatic coverKATSURA ROLLERS MFG CO LTD·Filed 1985·Granted Jun 16, 1987·24 cites·4 claims
- 1073US7942053B2Air flow measuring instrument having dust particle diverting structureHITACHI LTD·Filed 2008·Granted May 17, 2011·8 cites·6 claims
- 1170US4319397AMethod of producing semiconductor displacement transducerHITACHI LTD·Filed 1980·Granted Mar 16, 1982·22 cites·17 claims
- 1269US8104355B2Thermal humidity sensorMINAMITANI RINTARO·Filed 2010·Granted Jan 31, 2012·3 cites·7 claims
- 1364US6265784B1Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the deviceHITACHI LTD·Filed 1999·Granted Jul 24, 2001·32 cites·10 claims
- 1463US5936235ACylinder pressure sensorHITACHI LTD·Filed 1998·Granted Aug 10, 1999·23 cites·4 claims
- 1560US7437926B2Air flow rate measuring deviceHITACHI LTD·Filed 2007·Granted Oct 21, 2008·4 cites·37 claims
- 1658US4739125AElectric component part having lead terminalsHITACHI LTD·Filed 1986·Granted Apr 19, 1988·27 cites·5 claims
- 1754US7992435B2Air flow meterHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2009·Granted Aug 9, 2011·2 cites·10 claims
- 1854US7062964B2Heating resistor type flow measuring deviceHITACHI CAR ENG CO LTD·Filed 2001·Granted Jun 20, 2006·5 cites·15 claims
- 1954US6271601B1Wire bonding method and apparatus and semiconductor deviceHITACHI LTD·Filed 1999·Granted Aug 7, 2001·16 cites·14 claims
- 2048US4292618ASemiconductor strain gauge with elastic load plateHITACHI LTD·Filed 1980·Granted Sep 29, 1981·9 cites·5 claims
- 2145US5606487AElectronic device for offsetting adverse effects of a plurality of chips which repetitively produce large pulses of heatHITACHI LTD·Filed 1995·Granted Feb 25, 1997·12 cites·20 claims
- 2245US4604496ACeramic multilayer wiring boardHITACHI LTD·Filed 1984·Granted Aug 5, 1986·9 cites·6 claims
- 2339US6698282B2Heated type air flow rate sensor and its forming methodHITACHI LTD·Filed 2001·Granted Mar 2, 2004·2 cites·16 claims
- 2439US4838046ACover for a dampening roller of an offset pressKATSURA ROLLERS MFG CO LTD·Filed 1986·Granted Jun 13, 1989·7 cites·1 claims
- 2539US2011072897A1Heating Resistance Type Air Flow Rate Measuring DeviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2010·Application pending·0 cites
- 2638US2001042925A1Wire bonding method and apparatus, and semiconductor deviceFiled 2001·Application pending·0 cites
- 2735US2007089504A1Gas flow measuring apparatusHANZAWA KEIJI·Filed 2006·Application pending·0 cites
- 2830US6410978B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 25, 2002·1 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Akio Yasukawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →