Inventor · disambiguated record
Ta-Yang Lin
Also filed as: LIN TA-YANG
5 granted patents·75 citations·filing 2001–2003
80Inventor score
Files withTAIWAN SEMICONDUCTOR MFG5
Top patents by PatentIndex Score
5 records- 0175US6486054B1Method to achieve robust solder bump heightTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 26, 2002·25 cites·26 claims
- 0272US6696356B2Method of making a bump on a substrate without ribbon residueTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 24, 2004·23 cites·30 claims
- 0369US6624060B2Method and apparatus for pretreating a substrate prior to electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 23, 2003·22 cites·18 claims
- 0441US6941957B2Method and apparatus for pretreating a substrate prior to electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·4 cites·9 claims
- 0528US6784002B1Method to make wafer laser marks visable after bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·1 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →