Inventor · disambiguated record
Bodan Ma
Also filed as: MA BODAN
9 granted patents·3 pending applications·258 citations·filing 1998–2005
90Inventor score
Top patents by PatentIndex Score
12 records- 0184US6281314B1Compositions for use in the fabrication of circuit components and printed wire boardsNAT STARCH CHEM INVEST·Filed 1999·Granted Aug 28, 2001·46 cites·7 claims
- 0281US7608487B2B-stageable underfill encapsulant and method for its applicationHENKEL AG & CO KGAA·Filed 2005·Granted Oct 27, 2009·11 cites·6 claims
- 0380US6063828AUnderfill encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 1998·Granted May 16, 2000·65 cites·33 claims
- 0480US6057381AMethod of making an electronic component using reworkable underfill encapsulantsNAT STARCH CHEM INVEST·Filed 1998·Granted May 2, 2000·53 cites·32 claims
- 0579US6316566B1Package encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 1999·Granted Nov 13, 2001·31 cites·2 claims
- 0673US6833629B2Dual cure B-stageable underfill for wafer levelNAT STARCH CHEM INVEST·Filed 2001·Granted Dec 21, 2004·24 cites·2 claims
- 0763US7037399B2Underfill encapsulant for wafer packaging and method for its applicationNAT STARCH CHEM INVEST·Filed 2002·Granted May 2, 2006·13 cites·24 claims
- 0853US2005196437A1Hard capsulesFiled 2004·Application pending·0 cites
- 0949US6350838B2Package encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Feb 26, 2002·1 cites·27 claims
- 1049US6180187B1Method of making an electronic component using reworkable underfill encapsulantsNAT STARCH CHEM INVEST·Filed 1999·Granted Jan 30, 2001·14 cites·17 claims
- 1139US2004070510A1Radio frequency wetness detection systemFiled 2002·Application pending·0 cites
- 1234US2003164555A1B-stageable underfill encapsulant and method for its applicationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →