Inventor · disambiguated record
Tzong-Dar Her
Also filed as: HER TZONG-DAR
11 granted patents·2 pending applications·993 citations·filing 1999–2002
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0198US6218731B1Tiny ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Apr 17, 2001·384 cites·24 claims
- 0297US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 0397US6525942B2Heat dissipation ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Feb 25, 2003·199 cites·15 claims
- 0494US6650009B2Structure of a multi chip module having stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·102 cites·18 claims
- 0581US6583499B2Quad flat non-leaded package and leadframe for use in a quad flat non-leaded packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 24, 2003·31 cites·17 claims
- 0681US6541854B2Super low profile package with high efficiency of heat dissipationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 1, 2003·27 cites·16 claims
- 0775US6731015B2Super low profile package with stacked diesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 4, 2004·23 cites·16 claims
- 0858US6713321B2Super low profile package with high efficiency of heat dissipationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 30, 2004·7 cites·4 claims
- 0945US6291260B1Crack-preventive substrate and process for fabricating solder maskSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 18, 2001·3 cites·15 claims
- 1044US6391666B2Method for identifying defective elements in array molding of semiconductor packagingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted May 21, 2002·12 cites·5 claims
- 1136US2002094602A1DCA memory module and a fabrication method thereofFiled 2001·Application pending·0 cites
- 1230US2002000656A1Ball grid array package and a packaging process for sameFiled 1999·Application pending·0 cites
- 1329US6392425B1Multi-chip packaging having non-sticking test structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted May 21, 2002·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →