Inventor · disambiguated record
Hisayuki Imamura
Also filed as: IMAMURA HISAYUKI
11 granted patents·3 pending applications·148 citations·filing 1997–2023
89Inventor score
Top patents by PatentIndex Score
14 records- 0193US6846765B2Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrateHITACHI METALS LTD·Filed 2001·Granted Jan 25, 2005·91 cites·7 claims
- 0279US10669210B2Silicon nitride sintered substrate, silicon nitride sintered substrate sheet, circuit substrate, and production method for silicon nitride sintered substrateHITACHI METALS LTD·Filed 2017·Granted Jun 2, 2020·3 cites·20 claims
- 0377US7915533B2Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor moduleHITACHI METALS LTD·Filed 2006·Granted Mar 29, 2011·9 cites·4 claims
- 0474US8563869B2Circuit board and semiconductor module using this, production method for circuit boardKAGA YOUICHIROU·Filed 2006·Granted Oct 22, 2013·8 cites·10 claims
- 0574US7031166B2Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrateHITACHI METALS LTD·Filed 2004·Granted Apr 18, 2006·19 cites·4 claims
- 0673US7372132B2Resin encapsulated semiconductor device and the production methodHITACHI LTD·Filed 2005·Granted May 13, 2008·7 cites·13 claims
- 0766US9780011B2Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor moduleIMAMURA HISAYUKI·Filed 2012·Granted Oct 3, 2017·3 cites·16 claims
- 0864US2025197299A1Method of manufacturing silicon nitride substratePROTERIAL LTD·Filed 2023·Application pending·0 cites
- 0950US10057992B2Ceramic circuit substrate and its production methodHITACHI METALS LTD·Filed 2013·Granted Aug 21, 2018·0 cites·4 claims
- 1046US10559509B2Insulating substrate and semiconductor device using sameHITACHI METALS LTD·Filed 2017·Granted Feb 11, 2020·0 cites·11 claims
- 1143US2008315401A1Power Semiconductor Module And Method of Manufacturing the Power Semiconductor ModuleHITACHI LTD·Filed 2008·Application pending·0 cites
- 1242US5968426AMethod of producing porous silicon nitride ceramics having high strength and low thermal conductivityAGENCY IND SCIENCE TECHN·Filed 1997·Granted Oct 19, 1999·8 cites·2 claims
- 1335US8858865B2Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor moduleKAGA YOUICHIROU·Filed 2010·Granted Oct 14, 2014·0 cites·7 claims
- 1435US2005258550A1Circuit board and semiconductor device using the sameMORITA TOSHIAKI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →