Inventor · disambiguated record
Sunil A. Patel
Also filed as: PATEL SUNIL · PATEL SUNIL A · PATEL SUNIL ANUPRASAD
15 granted patents·2 pending applications·830 citations·filing 1996–2021
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US6335491B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2000·Granted Jan 1, 2002·129 cites·18 claims
- 0292US5909057AIntegrated heat spreader/stiffener with apertures for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Jun 1, 1999·142 cites·25 claims
- 0391US6166434ADie clip assembly for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Dec 26, 2000·128 cites·13 claims
- 0488US7383049B2Automation of maintenance and improvement of location service parameters in a data base of a wireless mobile communication systemQUALCOMM INC·Filed 2002·Granted Jun 3, 2008·76 cites·51 claims
- 0587US6020221AProcess for manufacturing a semiconductor device having a stiffener memberLSI LOGIC CORP·Filed 1996·Granted Feb 1, 2000·128 cites·9 claims
- 0686US6618938B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2001·Granted Sep 16, 2003·31 cites·18 claims
- 0785US5998242AVacuum assisted underfill process and apparatus for semiconductor package fabricationLSI LOGIC CORP·Filed 1997·Granted Dec 7, 1999·90 cites·23 claims
- 0873US6466038B1Non-isothermal electromigration testing of microelectronic packaging interconnectsLSI LOGIC CORP·Filed 2000·Granted Oct 15, 2002·19 cites·17 claims
- 0969US6002171AIntegrated heat spreader/stiffener assembly and method of assembly for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Dec 14, 1999·38 cites·19 claims
- 1065US9888360B2Methods to optimize and streamline AP placement on floor planQUALCOMM INC·Filed 2013·Granted Feb 6, 2018·4 cites·34 claims
- 1163US6306751B1Apparatus and method for improving ball joints in semiconductor packagesLSI LOGIC CORP·Filed 1999·Granted Oct 23, 2001·27 cites·11 claims
- 1262US6433565B1Test fixture for flip chip ball grid array circuitsLSI LOGIC CORP·Filed 2001·Granted Aug 13, 2002·10 cites·7 claims
- 1356US11533813B1Touchscreen display panel gripping mechanism and bezelROCKWELL COLLINS INC·Filed 2021·Granted Dec 20, 2022·0 cites·16 claims
- 1452US10292278B2Compact printed circuit board assembly with insulating endcap viaSEAGATE TECHNOLOGY LLC·Filed 2017·Granted May 14, 2019·0 cites·18 claims
- 1546US2010093377A1Creating And Using Base Station Almanac Information In A Wireless Communication System Having A Position Location CapabilityQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1641US2015264536A1Mobile device locating using limited access pointsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1738US6266249B1Semiconductor flip chip ball grid array packageLSI LOGIC CORP·Filed 1999·Granted Jul 24, 2001·8 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →