Inventor · disambiguated record
Shih-Kang Fu
Also filed as: FU SHIH-KANG
16 granted patents·5 pending applications·22 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
21 records- 0196US11742239B2Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·20 claims
- 0296US9530737B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·15 cites·25 claims
- 0388US2025316535A1Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0484US12362233B2Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 0581US9721894B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·2 cites·20 claims
- 0676US12205886B2Hybrid method for forming semiconductor interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 0772US12342600B2Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0871US10879115B2Semiconductor device and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·1 cites·17 claims
- 0971US9330989B2System and method for chemical-mechanical planarization of a metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 3, 2016·2 cites·20 claims
- 1071US2023118565A1Hybrid method for forming semiconductor interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1169US11810816B2Chemical mechanical polishing topography reset and control on interconnect metal linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1268US11450602B2Hybrid method for forming semiconductor interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 1367US11152255B2Methods of performing chemical-mechanical polishing process in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 1465US11342219B2Chemical mechanical polishing topography reset and control on interconnect metal linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 1564US11545389B2Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 1659US2025105140A1Semiconductor device including interconnect structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1757US11127680B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 21, 2021·0 cites·20 claims
- 1857US2025096140A1Interconnect structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024006233A1Semiconductor device including a self-formed barrier metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2048US11211256B2Method with CMP for metal ion preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 2139US10163700B2Method for forming conductive structure using polishing processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →