Inventor · disambiguated record
Nobuyuki Ikarashi
Also filed as: IKARASHI NOBUYUKI
14 granted patents·9 pending applications·99 citations·filing 2001–2015
90Inventor score
Top patents by PatentIndex Score
23 records- 0187US7592674B2Semiconductor device with silicide-containing gate electrode and method of fabricating the sameNEC CORP·Filed 2005·Granted Sep 22, 2009·14 cites·36 claims
- 0283US7968463B2Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layerRENESAS ELECTRONICS CORP·Filed 2007·Granted Jun 28, 2011·11 cites·31 claims
- 0382US6459126B1Semiconductor device including a MIS transistorNEC CORP·Filed 2001·Granted Oct 1, 2002·33 cites·17 claims
- 0481US8368175B2Capacitor, semiconductor device having the same, and method of producing themNEC CORP·Filed 2009·Granted Feb 5, 2013·8 cites·16 claims
- 0581US7545040B2Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor deviceNEC CORP·Filed 2003·Granted Jun 9, 2009·25 cites·8 claims
- 0666US8203176B2Dielectric, capacitor using dielectric, semiconductor device using dielectric, and manufacturing method of dielectricNAKAGAWA TAKASHI·Filed 2008·Granted Jun 19, 2012·2 cites·27 claims
- 0759US7476916B2Semiconductor device having a mis-type fet, and methods for manufacturing the same and forming a metal oxide filmNEC CORP·Filed 2004·Granted Jan 13, 2009·6 cites·8 claims
- 0855US9362110B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 7, 2016·0 cites·3 claims
- 0953US2009203208A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceNEC CORP·Filed 2009·Application pending·0 cites
- 1052US7495264B2Semiconductor device with high dielectric constant insulating film and manufacturing method for the sameNEC CORP·Filed 2006·Granted Feb 24, 2009·0 cites·11 claims
- 1151US8872234B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 28, 2014·0 cites·8 claims
- 1250US9263532B2Semiconductor device, semiconductor substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor substrateRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·0 cites·1 claims
- 1349US2008203500A1Semiconductor device and production method thereforNEC CORP·Filed 2008·Application pending·0 cites
- 1448US2012061844A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceUEKI MAKOTO·Filed 2011·Application pending·0 cites
- 1547US8975728B2Semiconductor device, semiconductor substrate, method for manufacturing device, and method for manufacturing semiconductor substrateIKARASHI NOBUYUKI·Filed 2012·Granted Mar 10, 2015·0 cites·17 claims
- 1642US2015014682A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1740US7812412B2Semiconductor deviceNEC CORP·Filed 2006·Granted Oct 12, 2010·0 cites·9 claims
- 1840US7164169B2Semiconductor device having high-permittivity insulation film and production method thereforNEC CORP·Filed 2002·Granted Jan 16, 2007·0 cites·30 claims
- 1939US2010219478A1Mosfet, method of fabricating the same, cmosfet, and method of fabricating the sameNEC CORP·Filed 2006·Application pending·0 cites
- 2038US2006131670A1Semiconductor device and production method thereforOGURA TAKASHI·Filed 2004·Application pending·0 cites
- 2135US2016005792A1Semiconductor memory device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2234US2011193145A1Crystal phase stabilizing structureRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2327US2012104614A1Semiconductor device manufacturing method and semiconductor deviceIKARASHI NOBUYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →