Inventor · disambiguated record
Shinya Osakabe
Also filed as: OSAKABE SHINYA
15 granted patents·3 pending applications·146 citations·filing 2004–2018
92Inventor score
Files withRENESAS TECH CORP5RENESAS ELECTRONICS CORP4MURATA MANUFACTURING CO3NAKAJIMA AKISHIGE2KUROKAWA ATSUSHI1
Top patents by PatentIndex Score
18 records- 0194US7269392B2Electric component for communication device and semiconductor device for switching transmission and receptionRENESAS TECH CORP·Filed 2004·Granted Sep 11, 2007·69 cites·2 claims
- 0290US9343360B2Bump-equipped electronic component and method for manufacturing bump-equipped electronic componentMURATA MANUFACTURING CO·Filed 2013·Granted May 17, 2016·9 cites·6 claims
- 0388US8824974B2Semiconductor integrated circuit device and radio frequency moduleNAKAJIMA AKISHIGE·Filed 2010·Granted Sep 2, 2014·14 cites·8 claims
- 0483US10432237B2MultiplexerTAIYO YUDEN KK·Filed 2018·Granted Oct 1, 2019·4 cites·11 claims
- 0582US7437129B2Electric component for communication device and semiconductor device for switching transmission and receptionRENESAS TECH CORP·Filed 2007·Granted Oct 14, 2008·10 cites·8 claims
- 0679US7307298B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 11, 2007·20 cites·21 claims
- 0778US9679860B2Bump-equipped electronic component and method for manufacturing bump-equipped electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted Jun 13, 2017·2 cites·4 claims
- 0876US7783265B2Switching element, antenna switch circuit and radio frequency module using the sameRENESAS TECH CORP·Filed 2008·Granted Aug 24, 2010·4 cites·19 claims
- 0976US7650134B2Semiconductor integrated circuit device and high frequency power amplifier moduleRENESAS TECH CORP·Filed 2006·Granted Jan 19, 2010·6 cites·16 claims
- 1071US7899412B2Switching element, antenna switch circuit and radio frequency module using the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 1, 2011·2 cites·20 claims
- 1161US7995972B2Electronic component for communication device and semiconductor device for switching transmission and receptionRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·3 cites·5 claims
- 1259US9362268B2Semiconductor integrated circuit device with transistor and non-transistor regionsKUROKAWA ATSUSHI·Filed 2012·Granted Jun 7, 2016·2 cites·11 claims
- 1359US7838914B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted Nov 23, 2010·1 cites·10 claims
- 1451US8385847B2Switching element, antenna switch circuit and radio frequency module using the sameRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 26, 2013·0 cites·20 claims
- 1550US2017236796A1Bump-equipped electronic component and method for manufacturing bump-equipped electronic componentMURATA MANUFACTURING CO·Filed 2017·Application pending·0 cites
- 1648US2006118951A1Switching element, antenna switch circuit and radio frequency module using the sameOGAWA TAKASHI·Filed 2005·Application pending·0 cites
- 1743US2008317154A1Semiconductor integrated circuit device and radio frequency moduleNAKAJIMA AKISHIGE·Filed 2007·Application pending·0 cites
- 1841US8169008B2Semiconductor deviceYAMANE MASAO·Filed 2010·Granted May 1, 2012·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →