Inventor · disambiguated record
Dominick A. Deangelis
Also filed as: DEANGELIS DOMINICK · DEANGELIS DOMINICK A · DEANGELIS DOMINICK ALBERT
22 granted patents·249 citations·filing 1983–2022
94Inventor score
Files withKULICKE & SOFFA IND INC17MARTIN MARIETTA CORP2DEANGELIS DOMINICK A1MOBIL OIL CORP1ORTHODYNE ELECTRONICS CORP1
Top patents by PatentIndex Score
22 records- 0194US5312152AShape memory metal actuated separation deviceMARTIN MARIETTA CORP·Filed 1991·Granted May 17, 1994·150 cites·20 claims
- 0291US11937979B2Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Mar 26, 2024·2 cites·18 claims
- 0390US10381321B2Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameKULICKE & SOFFA IND INC·Filed 2018·Granted Aug 13, 2019·5 cites·19 claims
- 0486US9362247B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2015·Granted Jun 7, 2016·4 cites·54 claims
- 0585US11462506B2Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameKULICKE & SOFFA IND INC·Filed 2021·Granted Oct 4, 2022·1 cites·21 claims
- 0683US9136240B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2014·Granted Sep 15, 2015·4 cites·51 claims
- 0781US11011492B2Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameKULICKE & SOFFA IND INC·Filed 2019·Granted May 18, 2021·2 cites·20 claims
- 0881US9780065B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2017·Granted Oct 3, 2017·3 cites·29 claims
- 0980US8251275B2Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducersDEANGELIS DOMINICK A·Filed 2010·Granted Aug 28, 2012·8 cites·24 claims
- 1079US9633981B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2016·Granted Apr 25, 2017·2 cites·14 claims
- 1179US5344506AShape memory metal actuator and cable cutterMARTIN MARIETTA CORP·Filed 1991·Granted Sep 6, 1994·38 cites·22 claims
- 1272US9905530B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2017·Granted Feb 27, 2018·1 cites·23 claims
- 1372US7137543B2Integrated flexure mount scheme for dynamic isolation of ultrasonic transducersKULICKE & SOFFA IND INC·Filed 2004·Granted Nov 21, 2006·19 cites·27 claims
- 1462US10987753B2Wedge bonding tools, wedge bonding systems, and related methodsKULICKE & SOFFA IND INC·Filed 2019·Granted Apr 27, 2021·0 cites·20 claims
- 1561US8365977B2Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducersKULICKE & SOFFA IND INC·Filed 2012·Granted Feb 5, 2013·1 cites·44 claims
- 1658US10449627B2Wedge bonding tools, wedge bonding systems, and related methodsKULICKE & SOFFA IND INC·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 1758US10312216B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2018·Granted Jun 4, 2019·0 cites·20 claims
- 1857US12235302B2Methods of detecting connection issues between a wire bonding tool and an ultrasonic transducer of a wire bonding machineKULICKE & SOFFA IND INC·Filed 2021·Granted Feb 25, 2025·0 cites·21 claims
- 1955US9931709B2Wedge bonding tools, wedge bonding systems, and related methodsORTHODYNE ELECTRONICS CORP·Filed 2017·Granted Apr 3, 2018·0 cites·18 claims
- 2053US10297568B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2017·Granted May 21, 2019·0 cites·19 claims
- 2146US9779965B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2017·Granted Oct 3, 2017·0 cites·25 claims
- 2236US4447332AFuel sludge treatment method, especially for leaded gasoline storage tank sludgeMOBIL OIL CORP·Filed 1983·Granted May 8, 1984·9 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →