Inventor

TEH WENG HONG

US47 patents

⚠️ This page may combine multiple inventors who share the name “TEH WENG HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEH WENG HONG

INTEL CORP

High density substrate routing in BBUL package

High density substrate routing in BBUL package

Bumpless build-up layer package including an integrated heat spreader

Bumpless build-up layer package including an integrated heat spreader

High density substrate routing in BBUL package

High density substrate routing in package

High density substrate routing in BBUL package

Embedded structures for package-on-package architecture

Bumpless build-up layer package including an integrated heat spreader

Embedded structures for package-on-package architecture

Semiconductor package having spacer layer

Method of forming a microelectronic device package

Magnetic field shielding for packaging build-up architectures

Embedded structures for package-on-package architecture

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

Optical interconnect on bumpless build-up layer package

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

High density substrate routing in package

Semiconductor package with air pressure sensor

High density substrate routing in package

Method of making an accelerometer

Semiconductor package having spacer layer

Optical interconnect on bumpless build-up layer package

Heterogeneous integration of microfluidic devices in package structures

Bumpless die-package interface for bumpless build-up layer (BBUL)

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

TEH WENG HONG

Semiconductor package with mechanical fuse

Multi die package having a die and a spacer layer in a recess

Secondary device integration into coreless microelectronic device packages

Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer

BBUL material integration in-plane with embedded die for warpage control

Controlled solder-on-die integrations on packages and methods of assembling same

Device, system and method for providing MEMS structures of a semiconductor package

Through-silicon via resonators in chip packages and methods of assembling same

Integration of laminate MEMS in BBUL coreless package

WESTERN DIGITAL TECH INC

System and method to enhance reliability in connection with arrangements including circuits

System and method to enhance solder joint reliability

System and method to enhance solder joint reliability

MA QING

Techniques, systems and devices related to acceleration measurement

Inductive inertial sensor architecture and fabrication in packaging build-up layers

MALATKAR PRAMOD

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

Lin kevin l

Semiconductor package with air pressure sensor

EXO IMAGING INC

Semiconductor package having spacer layer