Inventor · disambiguated record
Toshiya Akamatsu
Also filed as: AKAMATSU TOSHIYA
21 granted patents·6 pending applications·228 citations·filing 1995–2017
94Inventor score
Top patents by PatentIndex Score
27 records- 0195US5611481AIntegrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1995·Granted Mar 18, 1997·97 cites·12 claims
- 0285US6008071AMethod of forming solder bumps onto an integrated circuit deviceFUJITSU LTD·Filed 1996·Granted Dec 28, 1999·50 cites·18 claims
- 0384US9235001B2Optical device and optical moduleFUJITSU LTD·Filed 2015·Granted Jan 12, 2016·5 cites·7 claims
- 0474US7743966B2Soldering flux and method for bonding semiconductor elementFUJITSU LTD·Filed 2006·Granted Jun 29, 2010·3 cites·4 claims
- 0574US7604152B2Method for manufacturing a printed circuit board for electronic devices and an electronic device using the sameFUJITSU LTD·Filed 2006·Granted Oct 20, 2009·6 cites·18 claims
- 0672US6136047ASolder bump transfer plateFUJITSU LTD·Filed 1998·Granted Oct 24, 2000·26 cites·3 claims
- 0771US9412715B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2014·Granted Aug 9, 2016·2 cites·10 claims
- 0871US8740047B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Jun 3, 2014·2 cites·3 claims
- 0966US8556157B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameSAKUYAMA SEIKI·Filed 2011·Granted Oct 15, 2013·2 cites·8 claims
- 1064US6796025B2Method for mounting electronic part and paste materialFUJITSU LTD·Filed 2002·Granted Sep 28, 2004·12 cites·11 claims
- 1162US6608381B1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2000·Granted Aug 19, 2003·6 cites·9 claims
- 1257US8692386B2Semiconductor device, method of manufacturing semiconductor device, and electronic deviceAKAMATSU TOSHIYA·Filed 2011·Granted Apr 8, 2014·1 cites·20 claims
- 1356US8952271B2Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Granted Feb 10, 2015·0 cites·6 claims
- 1453US8673762B2Solder, soldering method, and semiconductor deviceAKAMATSU TOSHIYA·Filed 2011·Granted Mar 18, 2014·1 cites·4 claims
- 1553US2009090543A1Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1651US2010218853A1Soldering flux and method for bonding semiconductor elementFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1750US8901751B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2012·Granted Dec 2, 2014·0 cites·10 claims
- 1849US10056342B2Electronic component and electronic deviceFUJITSU LTD·Filed 2012·Granted Aug 21, 2018·0 cites·8 claims
- 1948US5977637AIntegrated electronic device having flip-chip connection with circuit boardFUJITSU LTD·Filed 1996·Granted Nov 2, 1999·8 cites·14 claims
- 2047US10062658B2Electronic component and electronic deviceFUJITSU LTD·Filed 2015·Granted Aug 28, 2018·0 cites·11 claims
- 2146US6764938B2Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1999·Granted Jul 20, 2004·7 cites·5 claims
- 2244US7879713B2Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrodeFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Feb 1, 2011·0 cites·6 claims
- 2344US2004209453A1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2444US2005062157A1Substrate with terminal pads having respective single solder bumps formed thereonFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2536US2017250153A1Electronic part, electronic device, and electronic apparatusFUJITSU LTD·Filed 2017·Application pending·0 cites
- 2634US2015371962A1Terminal structure, semiconductor device, and terminal forming methodFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2730US9472527B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2015·Granted Oct 18, 2016·0 cites·13 claims
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