Inventor · disambiguated record
Yeong Gyu Lee
Also filed as: LEE YEONG G · LEE YEONG GYU
28 granted patents·13 pending applications·166 citations·filing 1997–2021
95Inventor score
Top patents by PatentIndex Score
41 records- 0197US9929716B2Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Mar 27, 2018·27 cites·18 claims
- 0289US7394139B2Optical modulator module package using flip-chip mounting technologySAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 1, 2008·19 cites·4 claims
- 0385US9787280B2Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 10, 2017·5 cites·17 claims
- 0484US10263598B2Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Apr 16, 2019·4 cites·9 claims
- 0582US12184265B2Resonator package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 31, 2024·3 cites·13 claims
- 0679US7227267B2Semiconductor package using flip-chip mounting techniqueSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 5, 2007·10 cites·3 claims
- 0778US10715098B2Acoustic resonator packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 14, 2020·2 cites·17 claims
- 0870US6175675B1Apparatus for aligning and method of bonding optical waveguide device to optical fiber blockSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 16, 2001·37 cites·7 claims
- 0969US7116456B2Light modulator module packageSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 3, 2006·5 cites·4 claims
- 1066US10367471B2Resonator package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 30, 2019·1 cites·9 claims
- 1163US6526199B1Arrayed waveguide grating wavelength division multiplexer provided with alignment waveguides and apparatus for aligning the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 25, 2003·9 cites·12 claims
- 1258US6012856AMethod and article for splicing optical fibers coated with metal and reinforced splice formed therebySAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 11, 2000·22 cites·48 claims
- 1354US7078804B2Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 18, 2006·6 cites·6 claims
- 1453US7343072B2Light modulator package having inclined light transmissive lidSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 11, 2008·1 cites·5 claims
- 1552US7098535B2Semiconductor package and packaging method using flip-chip bonding technologySAMSUNG ELECTRO MECH·Filed 2004·Granted Aug 29, 2006·5 cites·3 claims
- 1651US10790798B2Acoustic resonator and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Sep 29, 2020·0 cites·16 claims
- 1750US2009027752A1Projection display apparatus for removing noiseSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1849US10329142B2Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 25, 2019·0 cites·18 claims
- 1947US10511281B2Acoustic wave resonator and filter including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 17, 2019·0 cites·16 claims
- 2047US2015096374A1Angular velocity sensor and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2147US2022200565A1Bulk-acoustic wave resonator packageSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 2245US9998094B2Bulk acoustic wave resonator having a frame spaced apart from an electrodeSAMSUNG ELECTRO MECH·Filed 2015·Granted Jun 12, 2018·0 cites·7 claims
- 2345US6915033B2Multi-channel optical switch and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Jul 5, 2005·1 cites·13 claims
- 2444US10637428B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 28, 2020·0 cites·14 claims
- 2544US10277196B2Bulk acoustic wave resonator and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 30, 2019·0 cites·19 claims
- 2643US2015102464A1Capacitor with hole structure and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2742US7388282B2Micro-electro-mechanical system (MEMS) package having hydrophobic layerSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 17, 2008·0 cites·8 claims
- 2842US2006078247A1Package structure for optical modulatorSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2941US10069472B2Bulk acoustic wave resonator and filter including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Sep 4, 2018·0 cites·18 claims
- 3041US7443024B2Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 28, 2008·0 cites·6 claims
- 3141US2007092179A1MEMS module packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3240US6278814B11×N optical wavelength-division demultiplexer alignment apparatus and 1×N optical wavelength-division demultiplexer thereforSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Aug 21, 2001·9 cites·19 claims
- 3340US2014118881A1Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3439US2007075417A1MEMS module package using sealing cap having heat releasing capability and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3538US8505190B2Method of manufacturing inertial sensorLEE HYUN KEE·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
- 3638US2005078920A1Micro optical communication device packageFiled 2003·Application pending·0 cites
- 3738US2005084205A1Wavelength division multiplexing system having built-in optical attenuatorFiled 2004·Application pending·0 cites
- 3834US2016329481A1Bulk acoustic wave resonator and filter including the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3933US10693438B2Acoustic wave resonator and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 23, 2020·0 cites·9 claims
- 4030US2011156836A1Duplexer device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4128US2012266673A1Inertial sensor and method of manufacturing the sameLEE HYUN KEE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →