Inventor · disambiguated record
Hyun Kee Lee
Also filed as: LEE HYUN KEE
9 granted patents·10 pending applications·96 citations·filing 2001–2016
87Inventor score
Top patents by PatentIndex Score
19 records- 0187US6459845B1Variable optical attenuatorSAMSUNG ELECTRO MECH·Filed 2002·Granted Oct 1, 2002·40 cites·4 claims
- 0277US6816295B2MEMS variable optical attenuatorSAMSUNG ELECTRO MECH·Filed 2003·Granted Nov 9, 2004·19 cites·10 claims
- 0371US6718114B2Variable optical attenuator of optical path conversionSAMSUNG ELECTRO MECH·Filed 2001·Granted Apr 6, 2004·14 cites·6 claims
- 0464US7113689B2Microelectromechanical systems (MEMS) variable optical attenuatorSAMSUNG ELECTRO MECH·Filed 2003·Granted Sep 26, 2006·9 cites·18 claims
- 0562US6552839B1Optical switchSAMSUNG ELECTRO MECH·Filed 2002·Granted Apr 22, 2003·8 cites·5 claims
- 0651US6833288B2Dicing method for micro electro mechnical system chipSAMSUNG ELECTRO MECH·Filed 2003·Granted Dec 21, 2004·4 cites·3 claims
- 0748US6961488B2Optical switch and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Nov 1, 2005·2 cites·6 claims
- 0847US10749098B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 18, 2020·0 cites·19 claims
- 0947US2015096374A1Angular velocity sensor and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1045US2014174179A1Inertial sensor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1144US2015274510A1Cap module for micro electro mechanical system and micro electro mechanical system sensor having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1240US2014042586A1Silicon substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1339US2005078931A1Multi-channel variable optical attenuator and fabrication method thereofFiled 2003·Application pending·0 cites
- 1438US8505190B2Method of manufacturing inertial sensorLEE HYUN KEE·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
- 1537US2004005735A1Dicing method for micro electro mechanical system chipSAMSUNG ELECTRO MECH·Filed 2003·Application pending·0 cites
- 1636US2015355220A1Inertial sensor module having hermetic seal formed of metal and multi-axis sensor employing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1736US2015355219A1Multi-axis sensorSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1833US2012125096A1Inertial sensorPARK HEUNG WOO·Filed 2011·Application pending·0 cites
- 1928US2012266673A1Inertial sensor and method of manufacturing the sameLEE HYUN KEE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →