Inventor · disambiguated record
Seiichi Shimoura
Also filed as: SHIMOURA SEIICHI
8 granted patents·3 pending applications·95 citations·filing 2001–2008
86Inventor score
Top patents by PatentIndex Score
11 records- 0186US6903876B2DisplayFUJITSU LTD·Filed 2002·Granted Jun 7, 2005·37 cites·13 claims
- 0283US6653761B2Micro-actuator and method of producing the sameFUJITSU LTD·Filed 2001·Granted Nov 25, 2003·22 cites·2 claims
- 0369US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 0466US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 0564US6848154B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2003·Granted Feb 1, 2005·8 cites·8 claims
- 0652US2008296266A1Processing apparatusFUJITSU LTD·Filed 2008·Application pending·0 cites
- 0748US2008298218A1Electronic device and manufacturing method of electronic deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 0848US2009044972A1Circuit board, method of forming wiring pattern, and method of manufacturing circuit boardFUJITSU LTD KAWASAKI JAPAN·Filed 2008·Application pending·0 cites
- 0947US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 1044US7356894B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·0 cites·4 claims
- 1133US8153941B2Method of heating superposed components and heating apparatus thereforFUJII MASANAO·Filed 2002·Granted Apr 10, 2012·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →