Inventor · disambiguated record
Szuchain Chen
Also filed as: CHEN SZUCHAIN · CHEN SZUCHAIN F
23 granted patents·7 pending applications·841 citations·filing 1992–2014
97Inventor score
Files withOLIN CORP20GBC METALS L L C3GBC METALS LLC2OLIN CORP A CORP OF THE COMMON2BRENNEMAN WILLIAM L1
Top patents by PatentIndex Score
30 records- 0194US6346335B1Copper foil composite including a release layerOLIN CORP·Filed 2000·Granted Feb 12, 2002·93 cites·35 claims
- 0292US5367196AMolded plastic semiconductor package including an aluminum alloy heat spreaderOLIN CORP·Filed 1992·Granted Nov 22, 1994·131 cites·29 claims
- 0390US5916695ATin coated electrical connectorOLIN CORP·Filed 1996·Granted Jun 29, 1999·104 cites·8 claims
- 0490US5780172ATin coated electrical connectorOLIN CORP·Filed 1996·Granted Jul 14, 1998·66 cites·15 claims
- 0587US5800930ANodular copper/nickel alloy treatment for copper foilOLIN CORP·Filed 1997·Granted Sep 1, 1998·73 cites·3 claims
- 0686US7391116B2Fretting and whisker resistant coating system and methodGBC METALS LLC·Filed 2004·Granted Jun 24, 2008·40 cites·2 claims
- 0784US7808109B2Fretting and whisker resistant coating system and methodGBC METALS L L C·Filed 2008·Granted Oct 5, 2010·10 cites·25 claims
- 0883US6183886B1Tin coatings incorporating selected elemental additions to reduce discolorationOLIN CORP·Filed 1998·Granted Feb 6, 2001·50 cites·7 claims
- 0982US6569543B2Copper foil with low profile bond enahncementOLIN CORP·Filed 2001·Granted May 27, 2003·29 cites·15 claims
- 1080US7132158B2Support layer for thin copper foilOLIN CORP·Filed 2004·Granted Nov 7, 2006·19 cites·3 claims
- 1177US6689268B2Copper foil composite including a release layerOLIN CORP·Filed 2001·Granted Feb 10, 2004·21 cites·10 claims
- 1277US6136460ATin coatings incorporating selected elemental additions to reduce discolorationOLIN CORP·Filed 1998·Granted Oct 24, 2000·38 cites·28 claims
- 1375US6083633AMulti-layer diffusion barrier for a tin coated electrical connectorOLIN CORP·Filed 1997·Granted Jul 4, 2000·41 cites·23 claims
- 1472US6893742B2Copper foil with low profile bond enhancementOLIN CORP·Filed 2001·Granted May 17, 2005·14 cites·1 claims
- 1571US5250363AChromium-zinc anti-tarnish coating for copper foil having a dark colorOLIN CORP·Filed 1992·Granted Oct 5, 1993·31 cites·20 claims
- 1670US7731831B2Method for manufacturing a composite material including copper foil and support layerGBC METALS L L C·Filed 2006·Granted Jun 8, 2010·3 cites·9 claims
- 1768US6852427B1Chromium-free antitarnish adhesion promoting treatment compositionOLIN CORP·Filed 2003·Granted Feb 8, 2005·12 cites·9 claims
- 1865US5230932AChromium-zinc anti-tarnish coating for copper foilOLIN CORP·Filed 1992·Granted Jul 27, 1993·22 cites·5 claims
- 1960US2011008616A1Support Layer for Thin Copper FoilBRENNEMAN WILLIAM L·Filed 2010·Application pending·0 cites
- 2056US5681662ACopper alloy foils for flexible circuitsOLIN CORP·Filed 1995·Granted Oct 28, 1997·15 cites·23 claims
- 2155US6905782B2Tarnish deterring tin coatingOLIN CORP·Filed 2004·Granted Jun 14, 2005·5 cites·16 claims
- 2253US5300158AProtective coating having adhesion improving characteristicsOLIN CORP·Filed 1992·Granted Apr 5, 1994·22 cites·14 claims
- 2353US2014308538A1Surface treated aluminum foil for electronic circuitsGBC METALS LLC·Filed 2014·Application pending·0 cites
- 2448US2007111016A1Laser ablation resistant copper foilOLIN CORP·Filed 2006·Application pending·0 cites
- 2544US7749611B2Peel strength enhancement of copper laminatesGBC METALS L L C·Filed 2003·Granted Jul 6, 2010·1 cites·10 claims
- 2642US6837980B2Bond enhancement antitarnish coatingsOLIN CORP·Filed 2001·Granted Jan 4, 2005·1 cites·16 claims
- 2742US2005123782A1Copper foil with low profile bond enhancementFiled 2005·Application pending·0 cites
- 2840US2004175582A1Laser ablation resistant copper foilOLIN CORP A CORP OF THE COMMON·Filed 2004·Application pending·0 cites
- 2940US2005118448A1Laser ablation resistant copper foilOLIN CORP A CORP OF THE COMMON·Filed 2004·Application pending·0 cites
- 3030US2005121330A1Chromium-free antitarnish adhesion promoting treatment compositionFiled 2005·Application pending·0 cites
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