Copper foil with low profile bond enhancement

Abstract

A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

1 . A composite material, comprising: 
 a carrier strip said carrier strip comprising a first side said first side possessing a substantially uniform roughness;    an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and said entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte; and    a release layer effective to facilitate separation of said metal foil layer from said carrier strip disposed between and contacting both said first side of said carrier strip and said second side of said metal foil layer.    
   
   
       2 . The composite material of  claim 1  wherein said substantially uniform roughness results from smooth rolling said first side of said carrier strip.  
   
   
       3 . The composite material of  claim 1  wherein said substantially uniform roughness results from microetching said first side of said carrier strip.  
   
   
       4 . The composite material of  claim 3  wherein said microetching of said first side of said carrier strip comprises the application of ammonium persulfate.  
   
   
       5 . The composite material of  claim 3  wherein said microetching of said first side of said carrier strip comprises the application of a sulfuric acid mixture.  
   
   
       6 . The composite material of  claim 1  wherein said substantially uniform roughness results from flashing said first side of said carrier strip with copper.  
   
   
       7 . The composite material of  claim 1  wherein said substantially uniform roughness results from flashing said first side of said carrier strip with nickel.  
   
   
       8 . The composite material of  claim 1  wherein said carrier strip is comprised of oxygen free copper.  
   
   
       9 . The composite material of  claim 1  wherein said carrier strip is comprised of a copper-nickel-silicon based alloy.  
   
   
       10 . The composite material of  claim 1  wherein said carrier strip has a tensile strength of at least 30 ksi.  
   
   
       11 . The composite material of  claim 1  wherein said carrier strip has a tensile strength of at least 100 ksi.  
   
   
       12 . A composite material, comprising: 
 a carrier strip said carrier strip comprising a first side said first side possessing a substantially uniform roughness;    an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and said entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte;    a dark layer effective to absorb light energy said dark layer having opposing first and second sides said first side of said dark layer in contact with said second side of said copper foil layer; and    a release layer effective to facilitate separation of said carrier strip from said dark layer disposed between and contacting both said first side of said carrier strip and said second side of said dark layer and effective to transmit the surface characteristics of said first side of said carrier strip to said second side of said dark layer.    
   
   
       13 . The composite material of  claim 12  wherein said substantially uniform roughness results from rough rolling said first side of said carrier strip.  
   
   
       14 . The composite material of  claim 12  wherein said substantially uniform roughness results from microetching said first side of said carrier strip.  
   
   
       15 . The composite material of  claim 12  wherein said substantially uniform roughness results from sand blasting said first side of said carrier strip.  
   
   
       16 . The composite material of  claim 12  wherein said substantially uniform roughness results from nodule plating said first side of said carrier strip.  
   
   
       17 . The composite material of  claim 12  wherein said dark layer has a thickness between 0.05 and 0.5 microns.  
   
   
       18 . The composite material of  claim 17  wherein said dark layer has an approximate thickness of 0.2 microns.  
   
   
       19 . The composite material of  claim 12  wherein said dark layer is comprised of a material selected from the group consisting of copper, nickel, tin, manganese, iron, and copper-nickel alloys.  
   
   
       20 . A method for the manufacture of a composite material comprising the steps of: 
 providing an electrically conductive support layer;    anodically treating said electrically conductive support layer in a first aqueous electrolyte containing first metal ions and hydroxide ions;    subsequent to said anodically treating step, cathodically depositing a release layer onto said electrically conductive support layer in a second aqueous electrolyte containing second metal ions and hydroxide ions; and    electrolytically depositing a metal foil layer on said release layer by immersion in a copper containing alkaline electrolyte for a period of time sufficient to achieve a thickness of said metal foil layer of approximately 1.0 to 15 microns.