Inventor · disambiguated record
Kwok Cheung Tsang
Also filed as: TSANG KWOK CHEUNG · TSANG KWOK F
25 granted patents·4 pending applications·1,850 citations·filing 2000–2023
97Inventor score
Top patents by PatentIndex Score
29 records- 0199US7482690B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2005·Granted Jan 27, 2009·86 cites·15 claims
- 0299US7372151B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted May 13, 2008·461 cites·8 claims
- 0398US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0498US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0597US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 0697US7009286B1Thin leadless plastic chip carrierASAT LTD·Filed 2004·Granted Mar 7, 2006·117 cites·11 claims
- 0796US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 0896US6964918B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2004·Granted Nov 15, 2005·84 cites·15 claims
- 0996US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 1095US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 1195US7081403B1Thin leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jul 25, 2006·28 cites·14 claims
- 1294US6781242B1Thin ball grid array packageASAT LTD·Filed 2002·Granted Aug 24, 2004·91 cites·12 claims
- 1390US7232755B1Process for fabricating pad frame and integrated circuit packageASAT LTD·Filed 2005·Granted Jun 19, 2007·20 cites·21 claims
- 1490US6586834B1Die-up tape ball grid array packageASAT LTD·Filed 2002·Granted Jul 1, 2003·78 cites·8 claims
- 1589US6429048B1Metal foil laminated IC packageASAT LTD·Filed 2000·Granted Aug 6, 2002·78 cites·14 claims
- 1688US6872661B1Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2002·Granted Mar 29, 2005·53 cites·19 claims
- 1783US7270867B1Leadless plastic chip carrierASAT LTD·Filed 2004·Granted Sep 18, 2007·34 cites·11 claims
- 1878US8610262B1Ball grid array package with improved thermal characteristicsMCLELLAN NEIL·Filed 2005·Granted Dec 17, 2013·9 cites·11 claims
- 1974US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 2072US9449903B2Ball grid array package with improved thermal characteristicsUTAC HONG KONG LTD·Filed 2013·Granted Sep 20, 2016·3 cites·7 claims
- 2164US9806006B2Etch isolation LPCC/QFN stripLI TUNG LOK·Filed 2007·Granted Oct 31, 2017·3 cites·20 claims
- 2256US12322690B2Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technologyAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 2356US2024379514A1Coreless substrates and manufacutring methods thereofAVAGO TECH INT SALES PTE LID·Filed 2023·Application pending·0 cites
- 2454US2024203898A1Electromagnetic shielding structureAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2553US2024145392A1Substrate with Differing Dielectric ConstantsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2649US9373576B2Flip chip pad geometry for an IC package substrateBROADCOM CORP·Filed 2014·Granted Jun 21, 2016·0 cites·18 claims
- 2749US7439099B1Thin ball grid array packageASAT LTD·Filed 2003·Granted Oct 21, 2008·3 cites·8 claims
- 2847US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims
- 2942US2007025242A1Dynamic allocation of aggregate bufferBROADCOM CORP·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →