Inventor · disambiguated record
Hoechul Kim
Also filed as: KIM HOECHUL
9 granted patents·3 pending applications·11 citations·filing 2019–2024
80Inventor score
Top patents by PatentIndex Score
12 records- 0193US10923452B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 16, 2021·7 cites·20 claims
- 0286US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 0380US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 0479US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0578US11594443B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·1 cites·19 claims
- 0676US12224262B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·10 claims
- 0770US12456631B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0861US11990444B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 21, 2024·0 cites·20 claims
- 0960US11721562B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·8 claims
- 1049US2023178345A1Method of cleaning chamberKIM KYOUNGRAN·Filed 2022·Application pending·0 cites
- 1147US11728197B2Wafer to wafer bonding apparatus and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 1246US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →