Inventor · disambiguated record
Kishore N. Renjan
Also filed as: RENJAN KISHORE N
12 granted patents·5 pending applications·17 citations·filing 2016–2024
85Inventor score
Files withAPPLE INC17
Top patents by PatentIndex Score
17 records- 0193US11651976B2Embedded packaging concepts for integration of ASICs and optical componentsAPPLE INC·Filed 2020·Granted May 16, 2023·4 cites·15 claims
- 0293US11552053B2Miniaturization of optical sensor modules through wirebonded ball stacksAPPLE INC·Filed 2020·Granted Jan 10, 2023·4 cites·19 claims
- 0392US11817383B2Packaging technologies for temperature sensing in health care productsAPPLE INC·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0487US11313741B2Packaging technologies for temperature sensing in health care productsAPPLE INC·Filed 2019·Granted Apr 26, 2022·5 cites·21 claims
- 0579US12028982B2Fabric-mounted componentsAPPLE INC·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 0676US11864322B2Fabric-mounted componentsAPPLE INC·Filed 2023·Granted Jan 2, 2024·0 cites·20 claims
- 0773US10037948B2Invisible compartment shieldingAPPLE INC·Filed 2016·Granted Jul 31, 2018·2 cites·19 claims
- 0868US11576262B2Fabric-mounted componentsAPPLE INC·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 0966US2023386865A1Embedded Packaging Concepts for Integration of ASICs and Optical ComponentsAPPLE INC·Filed 2023·Application pending·0 cites
- 1062US11765838B2Right angle sidewall and button interconnects for molded SiPsAPPLE INC·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 1160US12148741B2Sidewall connections and button interconnects for molded SiPsAPPLE INC·Filed 2022·Granted Nov 19, 2024·0 cites·16 claims
- 1260US12095185B2Built-in connector for board-to-board and flex-to-rigid board connectionAPPLE INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1358US12153268B2Technologies for increased volumetric and functional efficiencies of optical packagesAPPLE INC·Filed 2022·Granted Nov 26, 2024·0 cites·8 claims
- 1456US2025105228A1Barriers for Selective Exposed Molding of Variable Height ComponentsAPPLE INC·Filed 2023·Application pending·0 cites
- 1556US2025106995A1Compact interface through hinge connectorAPPLE INC·Filed 2024·Application pending·0 cites
- 1649US2023078536A1Conductive features on system-in-package surfacesAPPLE INC·Filed 2022·Application pending·0 cites
- 1747US2024107249A1Molded integrated circuit package with sensor assemblyAPPLE INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →