Inventor · disambiguated record
Jae Gil Lim
Also filed as: LIM JAE-GIL
1 granted patent·2 pending applications·0 citations·filing 2015–2019
11Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0143US11031307B2Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 0225US2017040289A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 0315US2015380359A1Semiconductor package including marking layerSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jae Gil Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →