Inventor · disambiguated record

Chan-Hee Jeong

Also filed as: JEONG CHAN HEE

3 granted patents·12 citations·filing 2017–2019

62Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0191US9978693B2Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·9 cites·20 claims
0281US10204869B2Integrated circuit package including shielding between adjacent chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 12, 2019·3 cites·22 claims
0343US11031307B2Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →