Inventor · disambiguated record
Je Sang Park
Also filed as: PARK JE SANG
15 granted patents·10 citations·filing 2019–2022
85Inventor score
Files withSAMSUNG ELECTRO MECH15
Top patents by PatentIndex Score
15 records- 0190US11627659B2Printed circuit board and electronic package comprising the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 11, 2023·2 cites·22 claims
- 0286US11587878B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 21, 2023·1 cites·4 claims
- 0384US10863627B1Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 8, 2020·5 cites·17 claims
- 0483US11183462B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0561US11658417B2Antenna substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted May 23, 2023·0 cites·18 claims
- 0660US12341252B2Antenna substrate and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 24, 2025·0 cites·11 claims
- 0760US12119565B2Antenna substrateSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 0859US11251133B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 15, 2022·0 cites·16 claims
- 0956US12446163B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 1054US10925163B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 16, 2021·0 cites·13 claims
- 1152US11631643B2Substrate embedded electronic component packageSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 1248US11075156B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·0 cites·19 claims
- 1346US11495546B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 1446US11244905B2Substrate with electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
- 1543US11640952B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →