Inventor · disambiguated record
Hyein Yoo
Also filed as: YOO HYEIN
8 granted patents·1 pending application·23 citations·filing 2015–2022
83Inventor score
Top patents by PatentIndex Score
9 records- 0192US10115613B2Method of fabricating a fan-out panel level package and a carrier tape film thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 30, 2018·5 cites·19 claims
- 0291US12183653B2Thermal conductive filmSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·2 cites·20 claims
- 0387US9842962B2Nanostructured hybrid particle, manufacturing method thereof, and device including the nanostructured hybrid particleKOREA INST SCI & TECH·Filed 2015·Granted Dec 12, 2017·5 cites·20 claims
- 0484US11355413B2Adhesive film, semiconductor apparatus using the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 7, 2022·4 cites·22 claims
- 0579US10354985B2Semiconductor device having stacked semiconductor chips and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 16, 2019·3 cites·20 claims
- 0677US10923465B2Semiconductor device having stacked semiconductor chips and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·2 cites·17 claims
- 0773US9929131B2Method of fabricating a semiconductor package having mold layer with curved cornerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·2 cites·19 claims
- 0852US10147713B2Semiconductor package having mold layer with curved corner and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 4, 2018·0 cites·20 claims
- 0932US2017358535A1Semiconductor packagesYOO HYEIN·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →