Inventor · disambiguated record
Anthony M. Fuller
Also filed as: FULLER ANTHONY · FULLER ANTHONY M
40 granted patents·7 pending applications·76 citations·filing 2007–2023
96Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO30MARDILOVICH PETER10HEWLETT PACKARD DEVELOPMENT CO LP6CHUNG BRADLEY D1
Top patents by PatentIndex Score
47 records- 0196US8870337B1Printhead die with damage detection conductor between multiple termination ringsHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Oct 28, 2014·22 cites·17 claims
- 0293US9776402B2Thermal ink jet printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Oct 3, 2017·12 cites·20 claims
- 0392US9359195B2Method of forming a nano-structureMARDILOVICH PETER·Filed 2010·Granted Jun 7, 2016·6 cites·17 claims
- 0491US11413864B2Die for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 0590US9624101B2Article with controlled wettabilityMARDILOVICH PETER·Filed 2010·Granted Apr 18, 2017·10 cites·4 claims
- 0689US11787180B2Corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 17, 2023·2 cites·15 claims
- 0789US11413865B2Fluid ejection devices including contact padsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Aug 16, 2022·2 cites·14 claims
- 0886US9447513B2Nano-scale structuresMARDILOVICH PETER·Filed 2011·Granted Sep 20, 2016·3 cites·15 claims
- 0986US8141986B2Heating elementCHUNG BRADLEY D·Filed 2010·Granted Mar 27, 2012·4 cites·18 claims
- 1085US9498953B2Printhead die with multiple termination ringsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Nov 22, 2016·3 cites·18 claims
- 1184US12391044B2Fluid ejection device with break(s) in cover layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1282US12491716B2Corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Dec 9, 2025·0 cites·15 claims
- 1382US10086612B2Fluid ejection device with ink feedhole bridgeHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 2, 2018·1 cites·18 claims
- 1481US11639055B2Fluid ejection devices including contact padsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted May 2, 2023·0 cites·15 claims
- 1581US9410260B2Method of forming a nano-structureMARDILOVICH PETER·Filed 2010·Granted Aug 9, 2016·2 cites·12 claims
- 1674US10933634B2Conductive wire disposed in a layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 2, 2021·1 cites·18 claims
- 1773US10927472B2Method of forming a micro-structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Feb 23, 2021·0 cites·15 claims
- 1873US9776407B2Fluid ejection device with ink feedhole bridgeHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Oct 3, 2017·1 cites·16 claims
- 1972US9611559B2Nano-structure and method of making the sameMARDILOVICH PETER·Filed 2010·Granted Apr 4, 2017·2 cites·10 claims
- 2070US11745507B2Fluid ejection device with break(s) in cover layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Sep 5, 2023·0 cites·15 claims
- 2170US10465308B2Adhesion-promoting surfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Nov 5, 2019·0 cites·12 claims
- 2269US10479080B2Fluid ejection device with ink feedhole bridgeHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 19, 2019·0 cites·15 claims
- 2368US9815282B2Fluid ejection structureHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Nov 14, 2017·1 cites·16 claims
- 2466US9751755B2Method of forming a micro-structureMARDILOVICH PETER·Filed 2010·Granted Sep 5, 2017·1 cites·13 claims
- 2564US10287697B2Nano-structure and method of making the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 14, 2019·0 cites·11 claims
- 2663US11383514B2Die for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jul 12, 2022·0 cites·17 claims
- 2757US2016319445A1Formation of capped nano-pillarsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Application pending·0 cites
- 2857US2013192992A1Adhesion-promoting surfaceMARDILOVICH PETER·Filed 2010·Application pending·0 cites
- 2955US11642884B2Die for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 9, 2023·0 cites·13 claims
- 3055US11267243B2Die for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 3154US11390081B2Fluid ejection device with a carrier having a slotHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jul 19, 2022·0 cites·12 claims
- 3253US11827021B2Applying mold chase structure to end portion of fluid ejection dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 28, 2023·0 cites·13 claims
- 3353US11097537B2Fluid ejection die molded into molded bodyHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 24, 2021·0 cites·14 claims
- 3452US11135839B2Die contact formationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 5, 2021·0 cites·15 claims
- 3552US10864719B2Fluid ejection device including integrated circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 15, 2020·0 cites·14 claims
- 3651US11721636B2Circuit die alignment targetHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 8, 2023·0 cites·11 claims
- 3750US11472180B2Fluid ejection devices including electrical interconnect elements for fluid ejection diesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 18, 2022·0 cites·21 claims
- 3849US9289987B2Heating element for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2012·Granted Mar 22, 2016·0 cites·15 claims
- 3949US7837886B2Heating elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Nov 23, 2010·0 cites·13 claims
- 4048US2013292253A1Formation of capped nano-pillarsMARDILOVICH PETER·Filed 2010·Application pending·0 cites
- 4147US8961799B2Nano-structured surfaceMARDILOVICH PETER·Filed 2011·Granted Feb 24, 2015·0 cites·15 claims
- 4246US10814629B2Termination ring with gapped metallic layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Oct 27, 2020·0 cites·15 claims
- 4346US7862156B2Heating elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jan 4, 2011·0 cites·20 claims
- 4446US2022176708A1Circulation path for bubblerHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4546US2017267520A1Method of forming a micro-structureHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2017·Application pending·0 cites
- 4645US2022048763A1Manufacturing a corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4739US2014174941A1Depositing nano-dots on a substrateMARDILOVICH PETER·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →