Inventor · disambiguated record
Chih-Hao Liao
Also filed as: LIAO CHIH-HAO
8 granted patents·6 pending applications·6 citations·filing 2008–2024
73Inventor score
Top patents by PatentIndex Score
14 records- 0168US7680615B2Parallel testing system with shared golden calibration table and method thereofAZUREWAVE TECHNOLOGIES INC·Filed 2008·Granted Mar 16, 2010·6 cites·10 claims
- 0255US2025324779A1Method of manufacturing image capturing module for reducing overall thicknessAZUREWAVE TECH INC·Filed 2024·Application pending·0 cites
- 0350US12394724B2Chip package structure and electromagnetic interference shielding package module thereofAZUREWAVE TECH INC·Filed 2022·Granted Aug 19, 2025·0 cites·10 claims
- 0450US12374629B2Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assemblyAZUREWAVE TECH INC·Filed 2022·Granted Jul 29, 2025·0 cites·4 claims
- 0548US2024047369A1Chip package structure and package module thereofAZUREWAVE TECH INC·Filed 2022·Application pending·0 cites
- 0648US2010009501A1Packaging structure, method for manufacturing the same, and method for using the sameHUANG CHUNG-ER·Filed 2009·Application pending·0 cites
- 0746US12108130B2Image sensor lens assembly and sensing module having externally sealed configurationAZUREWAVE TECH INC·Filed 2023·Granted Oct 1, 2024·0 cites·15 claims
- 0846US2025324152A1Image capturing module for reducing overall thickness and portable electronic device for using the sameAZUREWAVE TECH INC·Filed 2024·Application pending·0 cites
- 0945US12132977B2Image sensor lens assembly and sensing module having open configurationAZUREWAVE TECH INC·Filed 2023·Granted Oct 29, 2024·0 cites·15 claims
- 1045US2009179327A1Packaging structure, method for manufacturing the same, and method for using the sameHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
- 1144US11309626B2Wireless communication deviceAZUREWAVE TECH INC·Filed 2020·Granted Apr 19, 2022·0 cites·10 claims
- 1244US7675357B2Multi-system module having functional substrateAZUREWAVE TECHNOLOGIES INC·Filed 2008·Granted Mar 9, 2010·0 cites·8 claims
- 1343US11538730B2Chip scale package structure of heat-dissipating typeAZUREWAVE TECH INC·Filed 2020·Granted Dec 27, 2022·0 cites·10 claims
- 1438US2009174618A1RF module integrated with active antennaHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →