Inventor · disambiguated record
Jiamiao Tang
Also filed as: TANG JIAMIAO
11 granted patents·2 pending applications·303 citations·filing 2006–2016
91Inventor score
Top patents by PatentIndex Score
13 records- 0197US7659143B2Dual-chip integrated heat spreader assembly, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted Feb 9, 2010·71 cites·18 claims
- 0296US8084867B2Apparatus, system, and method for wireless connection in integrated circuit packagesTANG JIAMIAO·Filed 2006·Granted Dec 27, 2011·111 cites·14 claims
- 0396US7373033B2Chip-to-chip optical interconnectINTEL CORP·Filed 2006·Granted May 13, 2008·67 cites·19 claims
- 0494US7723164B2Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 25, 2010·32 cites·23 claims
- 0586US9385094B2Apparatus, system, and method for wireless connection in integrated circuit packagesINTEL CORP·Filed 2015·Granted Jul 5, 2016·4 cites·18 claims
- 0681US8513108B2Apparatus, system, and method for wireless connection in integrated circuit packagesTANG JIAMIAO·Filed 2011·Granted Aug 20, 2013·4 cites·20 claims
- 0780US9778688B2Flexible system-in-package solutions for wearable devicesINTEL CORP·Filed 2014·Granted Oct 3, 2017·5 cites·24 claims
- 0879US8981573B2Apparatus, system, and method for wireless connection in integrated circuit packagesINTEL CORP·Filed 2013·Granted Mar 17, 2015·3 cites·19 claims
- 0974US8963333B2Apparatus, system, and method for wireless connection in integrated circuit packagesINTEL CORP·Filed 2013·Granted Feb 24, 2015·2 cites·19 claims
- 1065US7535689B2Reducing input capacitance of high speed integrated circuitsINTEL CORP·Filed 2007·Granted May 19, 2009·4 cites·8 claims
- 1156US9837340B2Apparatus, system, and method for wireless connection in integrated circuit packagesINTEL CORP·Filed 2016·Granted Dec 5, 2017·0 cites·16 claims
- 1246US2016324487A1Wearable Personal Computer and Healthcare DevicesINTEL CORP·Filed 2014·Application pending·0 cites
- 1344US2009079064A1Methods of forming a thin tim coreless high density bump-less package and structures formed therebyTANG JIAMIAO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →