Inventor · disambiguated record
Sumikazu Hosoyamada
Also filed as: HOSOYAMADA SUMIKAZU
13 granted patents·2 pending applications·144 citations·filing 2000–2017
91Inventor score
Top patents by PatentIndex Score
15 records- 0189US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0286US10236231B2Semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Mar 19, 2019·5 cites·13 claims
- 0386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0486US6559536B1Semiconductor device having a heat spreading plateFUJITSU LTD·Filed 2000·Granted May 6, 2003·42 cites·13 claims
- 0580US6796024B2Method for making semiconductor deviceFUJITSU LTD·Filed 2003·Granted Sep 28, 2004·27 cites·3 claims
- 0678US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 0774US7476811B2Semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2005·Granted Jan 13, 2009·6 cites·7 claims
- 0873US6424032B1Semiconductor device having a power supply ring and a ground ringFUJITSU LTD·Filed 2000·Granted Jul 23, 2002·22 cites·4 claims
- 0966US7361980B2Semiconductor deviceFUJITSU LTD·Filed 2005·Granted Apr 22, 2008·3 cites·9 claims
- 1062US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 1150US10134710B2Semiconductor packageJ DEVICES CORP·Filed 2017·Granted Nov 20, 2018·0 cites·5 claims
- 1247US9601450B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Mar 21, 2017·0 cites·15 claims
- 1347US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1443US2015243576A1Semiconductor deviceJ DEVICES CORP·Filed 2015·Application pending·0 cites
- 1539US7042102B2Semiconductor deviceFUJITSU LTD·Filed 2004·Granted May 9, 2006·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →