Inventor · disambiguated record
Mohammad Akhavain
Also filed as: AKHAVAIN MOHAMMAD · AKHAVIN MOHAMMAD
23 granted patents·1 pending application·1,025 citations·filing 1993–2007
96Inventor score
Top patents by PatentIndex Score
24 records- 0198US6557976B2Electrical circuit for wide-array inkjet printhead assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted May 6, 2003·317 cites·14 claims
- 0298US6350013B1Carrier positioning for wide-array inkjet printhead assemblyHEWLETT PACKARD CO·Filed 2000·Granted Feb 26, 2002·132 cites·43 claims
- 0397US6450614B1Printhead die alignment for wide-array inkjet printhead assemblyHEWLETT PACKARD CO·Filed 2000·Granted Sep 17, 2002·93 cites·34 claims
- 0494US6543880B1Inkjet printhead assembly having planarized mounting layer for printhead diesHEWLETT PACKARD CO·Filed 2000·Granted Apr 8, 2003·126 cites·52 claims
- 0591US6431683B1Hybrid carrier for wide-array inkjet printhead assemblyHEWLETT PACKARD CO·Filed 2001·Granted Aug 13, 2002·43 cites·32 claims
- 0691US6428141B1Reference datums for inkjet printhead assemblyHEWLETT PACKARD CO·Filed 2001·Granted Aug 6, 2002·46 cites·45 claims
- 0785US6705705B2Substrate for fluid ejection devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Mar 16, 2004·23 cites·48 claims
- 0885US5341564AMethod of fabricating integrated circuit moduleUNISYS CORP·Filed 1993·Granted Aug 30, 1994·117 cites·9 claims
- 0982US6575559B2Joining of different materials of carrier for fluid ejection devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jun 10, 2003·23 cites·49 claims
- 1082US6409307B1Coplanar mounting of printhead dies for wide-array inkjet printhead assemblyHEWLETT PACKARD CO·Filed 2001·Granted Jun 25, 2002·23 cites·35 claims
- 1175US6951778B2Edge-sealed substrates and methods for effecting the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 4, 2005·25 cites·13 claims
- 1271US7480994B2Method of making a fluid ejection head for a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jan 27, 2009·5 cites·8 claims
- 1362US6843552B2Electrical circuit for printhead assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jan 18, 2005·7 cites·32 claims
- 1457US7211736B2Connection pad layoutsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 1, 2007·5 cites·19 claims
- 1556US7188925B2Fluid ejection head assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 13, 2007·5 cites·13 claims
- 1655US6983539B2Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumpsHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 10, 2006·5 cites·9 claims
- 1753US6397465B1Connection of electrical contacts utilizing a combination laser and fiber optic push connect systemHEWLETT PACKARD CO·Filed 1997·Granted Jun 4, 2002·16 cites·12 claims
- 1848US6698092B2Methods and systems for forming a die packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 2, 2004·2 cites·2 claims
- 1946US2007169342A1Connection pad layoutsLASSAR NOAH·Filed 2007·Application pending·0 cites
- 2044US7338149B2Methods for forming and protecting electrical interconnects and resultant assembliesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 4, 2008·0 cites·29 claims
- 2142US6236015B1Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bondingHEWLETT PACKARD CO·Filed 1998·Granted May 22, 2001·11 cites·6 claims
- 2241US7103969B2Methods and systems for forming a die packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Sep 12, 2006·0 cites·2 claims
- 2341US6476346B2Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bondingHEWLETT PACKARD CO·Filed 2001·Granted Nov 5, 2002·1 cites·12 claims
- 2439US6913343B2Methods for forming and protecting electrical interconnects and resultant assembliesHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 5, 2005·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →