Inventor · disambiguated record
Tyler Sherwood
Also filed as: SHERWOOD TYLER · SHERWOOD TYLER JAMES
13 granted patents·8 pending applications·10 citations·filing 2019–2023
83Inventor score
Top patents by PatentIndex Score
21 records- 0195US11586067B2Structure and method of advanced LCoS back-plane having robust pixel via metallizationAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·5 cites·18 claims
- 0295US11573452B2Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processesAPPLIED MATERIALS INC·Filed 2020·Granted Feb 7, 2023·5 cites·17 claims
- 0362US11881539B2Structure and method of advanced LCoS back-plane having highly reflective pixel via metallizationAPPLIED MATERIALS INC·Filed 2020·Granted Jan 23, 2024·0 cites·13 claims
- 0459US12055821B2Structure and method of bi-layer pixel isolation in advanced LCOS back-planeAPPLIED MATERIALS INC·Filed 2020·Granted Aug 6, 2024·0 cites·13 claims
- 0556US11705490B2Graded doping in power devicesAPPLIED MATERIALS INC·Filed 2021·Granted Jul 18, 2023·0 cites·19 claims
- 0656US11456171B2Deep trench integration processes and devicesAPPLIED MATERIALS INC·Filed 2020·Granted Sep 27, 2022·0 cites·12 claims
- 0756US11410873B2Deep trench integration processes and devicesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 0856US2025079357A1Methods and structures for high strength asymmetric dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0956US2025079312A1Methods and structures for high strength dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1056US2025087573A1Method and material system for tunable hybrid bond interconnect resistanceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1155US11880052B2Structure and method of mirror grounding in LCoS devicesAPPLIED MATERIALS INC·Filed 2020·Granted Jan 23, 2024·0 cites·6 claims
- 1255US11769665B2Power device structures and methods of makingAPPLIED MATERIALS INC·Filed 2022·Granted Sep 26, 2023·0 cites·19 claims
- 1355US2025079356A1Method and material system for high strength selective dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1454US11830824B2Edge protection on semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·17 claims
- 1554US2024321636A1Method to improve interconnect coefficient of thermal expansionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1653US11908678B2Method of CMP integration for improved optical uniformity in advanced LCOS back-planeAPPLIED MATERIALS INC·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 1753US11605741B2Methods of forming doped silicide power devicesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 14, 2023·0 cites·20 claims
- 1851US2024282809A1Silicon super junction structures for increased voltageAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1950US2023369532A1Stress relaxation trenches for gallium nitride microled layers on silicon substratesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2048US12033964B2Chemical mechanical polishing for copper dishing controlAPPLIED MATERIALS INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 2142US2021091222A1Fin structures of finfet devicesGLOBALFOUNDRIES US INC·Filed 2019·Application pending·0 cites
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