Inventor · disambiguated record
Laurent-Georges Gosset
Also filed as: GOSSET LAURENT · GOSSET LAURENT G · GOSSET LAURENT GEORGES
14 granted patents·4 pending applications·121 citations·filing 2004–2013
91Inventor score
Top patents by PatentIndex Score
18 records- 0186US7936563B2On-chip interconnect-stack cooling using sacrificial interconnect segmentsNXP BV·Filed 2006·Granted May 3, 2011·17 cites·19 claims
- 0285US7172980B2Process for fabricating an integrated electronic circuit that incorporates air gapsKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Granted Feb 6, 2007·46 cites·12 claims
- 0383US8470685B2Integration of self-aligned trenches in-between metal linesTORRES JOAQUIN·Filed 2007·Granted Jun 25, 2013·14 cites·11 claims
- 0479US8399772B2Control of carbon nanostructure growth in an interconnect structureGOSSET LAURENT·Filed 2007·Granted Mar 19, 2013·10 cites·20 claims
- 0578US8110879B2Controlling lateral distribution of air gaps in interconnectsTORRES JOAQUIN·Filed 2009·Granted Feb 7, 2012·7 cites·15 claims
- 0676US8138082B2Method for forming metal interconnects in a dielectric materialTORRES JOAQUIN·Filed 2007·Granted Mar 20, 2012·8 cites·19 claims
- 0766US8097949B2Control of localized air gap formation in an interconnect stackGOSSET LAURENT·Filed 2007·Granted Jan 17, 2012·6 cites·8 claims
- 0866US7605071B2Controlling lateral distribution of air gaps in interconnectsST MICROELECTRONICS CROLLES 2·Filed 2006·Granted Oct 20, 2009·3 cites·18 claims
- 0965US7630191B2MIM capacitorST MICROELECTRONICS CROLLES 2·Filed 2007·Granted Dec 8, 2009·3 cites·15 claims
- 1063US8143157B2Fabrication of a diffusion barrier cap on copper containing conductive elementsTORRES JOAQUIN·Filed 2007·Granted Mar 27, 2012·3 cites·11 claims
- 1159US8424177B2MIM capacitor with enhanced capacitanceFARCY ALEXIS·Filed 2010·Granted Apr 23, 2013·2 cites·10 claims
- 1255US7553739B2Integration control and reliability enhancement of interconnect air cavitiesSTMICROELECTRONICS CORLLES 2 S·Filed 2006·Granted Jun 30, 2009·2 cites·21 claims
- 1345US2010059889A1Adhesion of diffusion barrier on copper-containing interconnect elementNXP BV·Filed 2007·Application pending·0 cites
- 1444US7989342B2Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientationsTORRES JOAQUIN·Filed 2008·Granted Aug 2, 2011·0 cites·8 claims
- 1544US2013286540A1Mim capacitorNXP B V DUTCH CORP·Filed 2013·Application pending·0 cites
- 1643US2009321946A1Process for fabricating an integrated electronic circuit incorporating a process requiring a voltage threshold between a metal layer and a substrateNXP BV·Filed 2007·Application pending·0 cites
- 1742US2009051033A1Reliability improvement of metal-interconnect structure by capping spacersNXP BV·Filed 2006·Application pending·0 cites
- 1836US8871606B2Microelectromechanical device packaging with an anchored cap and its manufactureCHARBUILLET CLEMENT·Filed 2006·Granted Oct 28, 2014·0 cites·13 claims
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