Inventor · disambiguated record
Doo Hyun Park
Also filed as: PARK DOO · PARK DOO HYUN
66 granted patents·10 pending applications·928 citations·filing 1995–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC39AMKOR TECH SINGAPORE HOLDING PTE LTD21PAEK JONG SIK3PARK DOO HYUN3UNIV MICHIGAN STATE3
Top patents by PatentIndex Score
76 records- 0199US9214434B1Fan-out semiconductor packageAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 15, 2015·55 cites·33 claims
- 0299US8552556B1Wafer level fan out packageKIM JIN YOUNG·Filed 2011·Granted Oct 8, 2013·105 cites·16 claims
- 0398US9000586B2Semiconductor device and manufacturing method thereofDO WON CHUL·Filed 2012·Granted Apr 7, 2015·49 cites·20 claims
- 0497US11764078B2Stiffener package and method of fabricating stiffener packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0597US7902660B1Substrate for semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·188 cites·15 claims
- 0696US9484331B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 1, 2016·18 cites·26 claims
- 0795US11107701B2Stiffener package and method of fabricating stiffener packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 31, 2021·3 cites·20 claims
- 0895US9391043B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 12, 2016·12 cites·20 claims
- 0995US9048125B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 2, 2015·20 cites·20 claims
- 1094US10079157B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 18, 2018·9 cites·20 claims
- 1193US10224217B1Wafer level fan out package and method of fabricating wafer level fan out packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 5, 2019·7 cites·20 claims
- 1293US9627368B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 18, 2017·11 cites·19 claims
- 1393US6270649B1Electrochemical methods for generation of a biological proton motive force and pyridine nucleotide cofactor regenerationUNIV MICHIGAN STATE·Filed 1999·Granted Aug 7, 2001·102 cites·6 claims
- 1491US10535536B2Stiffener package and method of fabricating stiffener packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Jan 14, 2020·4 cites·20 claims
- 1591US10032740B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·5 cites·13 claims
- 1691US9966276B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·5 cites·20 claims
- 1791US9418922B2Semiconductor device with reduced thicknessAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·12 cites·17 claims
- 1891US8089159B1Semiconductor package with increased I/O density and method of making the samePARK DOO HYUN·Filed 2007·Granted Jan 3, 2012·31 cites·21 claims
- 1990US10297466B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 21, 2019·4 cites·20 claims
- 2090US9219042B2Semiconductor device and manufacturing method thereofPAEK JONG SIK·Filed 2013·Granted Dec 22, 2015·10 cites·19 claims
- 2189US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2288US9818685B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 2388US9437575B1Semiconductor device package formed in a chip-on-wafer last process using thin film adhesivesAMKOR TECHNOLOGY INC·Filed 2014·Granted Sep 6, 2016·8 cites·19 claims
- 2486US7202554B1Semiconductor package and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Granted Apr 10, 2007·40 cites·19 claims
- 2585US12211705B2Stiffener package and method of fabricating stiffener packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2685US9536858B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 2785US5976719AMediator-less biofuel cellKOREA INST SCI & TECH·Filed 1997·Granted Nov 2, 1999·87 cites·5 claims
- 2885US2024304583A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2983US11043464B2Semiconductor device having upper and lower redistribution layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Jun 22, 2021·2 cites·18 claims
- 3083US9478517B2Electronic device package structure and method of fabricating the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 25, 2016·6 cites·20 claims
- 3183US8227921B1Semiconductor package with increased I/O density and method of making samePARK DOO HYUN·Filed 2011·Granted Jul 24, 2012·7 cites·20 claims
- 3283US2024266189A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3382US11101144B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·2 cites·21 claims
- 3482US10679952B2Semiconductor device having an encapsulated front side and interposer and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 9, 2020·2 cites·22 claims
- 3581US10388643B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 3680US12388032B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 3780US10707181B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 7, 2020·3 cites·16 claims
- 3879US7250288B2Electrode compositions and configurations for electrochemical bioreactor systemsUNIV MICHIGAN STATE·Filed 2002·Granted Jul 31, 2007·33 cites·21 claims
- 3979US2023223365A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 4078US9406638B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·2 cites·20 claims
- 4178US2023057803A1Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 4277US2025157956A1Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 4376US12362343B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 15, 2025·0 cites·25 claims
- 4476US10199322B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 5, 2019·1 cites·20 claims
- 4575US11935856B2Semiconductor device having a redistribution layerAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Mar 19, 2024·0 cites·14 claims
- 4675US11501978B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 4774US11961742B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·18 claims
- 4872US11600582B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·12 claims
- 4972US11527496B2Semiconductor device comprising semiconductor die and interposer and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 5072US11424180B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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