Inventor · disambiguated record
Randy Bindrup
Also filed as: BINDRUP RANDY · BINDRUP RANDY WAYNE
7 granted patents·3 pending applications·16 citations·filing 2004–2016
79Inventor score
Top patents by PatentIndex Score
10 records- 0172US7215854B2Low-loss optical waveguide crossovers using an out-of-plane waveguideGEMFIRE CORP·Filed 2005·Granted May 8, 2007·6 cites·21 claims
- 0263US8637985B2Anti-tamper wrapper interconnect method and a deviceBINDRUP RANDY·Filed 2012·Granted Jan 28, 2014·2 cites·5 claims
- 0363US7772045B1Wire bond method for angularly disposed conductive pads and a device made from the methodBINDRUP RANDY WAYNE·Filed 2007·Granted Aug 10, 2010·5 cites·40 claims
- 0459US9431275B2Wire bond through-via structure and methodBINDRUP RANDY·Filed 2011·Granted Aug 30, 2016·1 cites·12 claims
- 0548US9741680B1Wire bond through-via structure and methodPFG IP LLC·Filed 2016·Granted Aug 22, 2017·0 cites·1 claims
- 0641US7062130B2Low-loss optical waveguide crossovers using an out-of-plane waveguideTELKAMP ARTHUR·Filed 2004·Granted Jun 13, 2006·2 cites·31 claims
- 0735US2012069528A1Method for Control of Solder Collapse in Stacked Microelectronic StructureBINDRUP RANDY·Filed 2011·Application pending·0 cites
- 0834US2011085304A1Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole viasIRVINE SENSORS CORP·Filed 2010·Application pending·0 cites
- 0932US8609473B2Method for fabricating a neo-layer using stud bumped bare dieLIEU PETER·Filed 2011·Granted Dec 17, 2013·0 cites·1 claims
- 1031US2012211886A1Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the MethodLIEU PETER·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →