Inventor · disambiguated record
Glenn Rinne
Also filed as: RINNE GLENN · RINNE GLENN A · RINNE GLENN ARNE
81 granted patents·7 pending applications·1,873 citations·filing 1992–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC26UNITIVE INT LTD19MCNC15AMKOR TECH SINGAPORE HOLDING PTE LTD9X DISPLAY COMPANY TECH LTD7
Top patents by PatentIndex Score
88 records- 0197US11569425B2Surface-mountable pixel packages and pixel enginesX DISPLAY COMPANY TECH LTD·Filed 2021·Granted Jan 31, 2023·5 cites·11 claims
- 0297US8362612B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·53 cites·20 claims
- 0396US9490231B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 8, 2016·14 cites·20 claims
- 0496US6492197B1Trilayer/bilayer solder bumps and fabrication methods thereforUNITIVE ELECTRONICS INC·Filed 2000·Granted Dec 10, 2002·128 cites·46 claims
- 0595US5892179ASolder bumps and structures for integrated redistribution routing conductorsMCNC·Filed 1997·Granted Apr 6, 1999·91 cites·20 claims
- 0695US5289631AMethod for testing, burn-in, and/or programming of integrated circuit chipsMCNC·Filed 1992·Granted Mar 1, 1994·222 cites·9 claims
- 0794US7427557B2Methods of forming bumps using barrier layers as etch masksUNITIVE INT LTD·Filed 2005·Granted Sep 23, 2008·28 cites·15 claims
- 0893US9627368B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 18, 2017·11 cites·19 claims
- 0993US7932615B2Electronic devices including solder bumps on compliant dielectric layersAMKOR TECHNOLOGY INC·Filed 2007·Granted Apr 26, 2011·29 cites·20 claims
- 1093US7297631B2Methods of forming electronic structures including conductive shunt layers and related structuresUNITIVE INT LTD·Filed 2005·Granted Nov 20, 2007·25 cites·32 claims
- 1192US11127889B2Displays with unpatterned layers of light-absorbing materialX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Sep 21, 2021·6 cites·20 claims
- 1292US10056349B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 21, 2018·5 cites·20 claims
- 1392US6418033B1Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute anglesUNITIVE ELECTRONICS INC·Filed 2000·Granted Jul 9, 2002·61 cites·57 claims
- 1492US6392163B1Controlled-shaped solder reservoirs for increasing the volume of solder bumpsUNITIVE INT LTD·Filed 2001·Granted May 21, 2002·73 cites·28 claims
- 1592US6329608B1Key-shaped solder bumps and under bump metallurgyUNITIVE INT LTD·Filed 1999·Granted Dec 11, 2001·65 cites·13 claims
- 1691US10410993B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·4 cites·20 claims
- 1791US10304697B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·6 cites·19 claims
- 1891US9978644B1Semiconductor device and manufacturing methodAMKOR TECHNOLOGY INC·Filed 2016·Granted May 22, 2018·6 cites·20 claims
- 1991US7213740B2Optical structures including liquid bumps and related methodsUNITIVE INT LTD·Filed 2005·Granted May 8, 2007·16 cites·8 claims
- 2091US6233088B1Methods for modulating a radiation signalMCNC·Filed 2000·Granted May 15, 2001·43 cites·26 claims
- 2190US9837376B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·4 cites·20 claims
- 2290US6389691B1Methods for forming integrated redistribution routing conductors and solder bumpsUNITIVE INT LTD·Filed 1999·Granted May 21, 2002·59 cites·29 claims
- 2390US5963793AMicroelectronic packaging using arched solder columnsMCNC·Filed 1998·Granted Oct 5, 1999·98 cites·21 claims
- 2489US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2588US11094870B2Surface-mountable pixel packages and pixel enginesX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Aug 17, 2021·2 cites·21 claims
- 2687US12327812B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Jun 10, 2025·0 cites·22 claims
- 2787US6137623AModulatable reflectors and methods for using sameMCNC·Filed 1998·Granted Oct 24, 2000·71 cites·30 claims
- 2885US6960828B2Electronic structures including conductive shunt layersUNITIVE INT LTD·Filed 2003·Granted Nov 1, 2005·31 cites·18 claims
- 2985US6863209B2Low temperature methods of bonding componentsUNITIVIE INTERNAT LTD·Filed 2001·Granted Mar 8, 2005·27 cites·55 claims
- 3085US6388203B1Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed therebyUNITIVE INT LTD·Filed 1998·Granted May 14, 2002·74 cites·21 claims
- 3185US5447264ARecessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1994·Granted Sep 5, 1995·79 cites·26 claims
- 3284US7834454B2Electronic structures including barrier layers defining lipsUNITIVE INT LTD·Filed 2008·Granted Nov 16, 2010·9 cites·21 claims
- 3384US7674701B2Methods of forming metal layers using multi-layer lift-off patternsAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·12 cites·30 claims
- 3484US5793116AMicroelectronic packaging using arched solder columnsMCNC·Filed 1996·Granted Aug 11, 1998·66 cites·19 claims
- 3583US9875980B2Copper pillar sidewall protectionAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 23, 2018·6 cites·15 claims
- 3683US7755164B1Capacitor and resistor having anodic metal and anodic metal oxide structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 13, 2010·10 cites·19 claims
- 3783US7531898B2Non-Circular via holes for bumping pads and related structuresUNITIVE INT LTD·Filed 2005·Granted May 12, 2009·12 cites·40 claims
- 3882US6117299AMethods of electroplating solder bumps of uniform height on integrated circuit substratesMCNC·Filed 1997·Granted Sep 12, 2000·91 cites·27 claims
- 3982US5381946AMethod of forming differing volume solder bumpsMCNC·Filed 1993·Granted Jan 17, 1995·60 cites·8 claims
- 4081US10388643B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 4181US7839000B2Solder structures including barrier layers with nickel and/or copperUNITIVE INT LTD·Filed 2009·Granted Nov 23, 2010·11 cites·18 claims
- 4280US7871899B2Methods of forming back side layers for thinned wafersAMKOR TECHNOLOGY INC·Filed 2007·Granted Jan 18, 2011·10 cites·34 claims
- 4380US7547623B2Methods of forming lead free solder bumpsUNITIVE INT LTD·Filed 2005·Granted Jun 16, 2009·11 cites·28 claims
- 4479US6793792B2Electroplating methods including maintaining a determined electroplating voltage and related systemsUNITIVE INT LTD·Filed 2002·Granted Sep 21, 2004·16 cites·36 claims
- 4577US10832921B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 4676US12362343B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 15, 2025·0 cites·25 claims
- 4776US11901332B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 4875US8294269B2Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometersNAIR KRISHNA K·Filed 2010·Granted Oct 23, 2012·4 cites·17 claims
- 4975US2025167007A1Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 5074US11916033B2Method and system for packing optimization of semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 27, 2024·0 cites·19 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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